Hiroo Kurosaki

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Nagahama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 7,334,324
- Issue date Feb 26, 2008
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device integrated multilayer wiring board
- Patent number 7,022,399
- Issue date Apr 4, 2006
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, semiconductor device mounting board using...
- Patent number 6,797,367
- Issue date Sep 28, 2004
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of Manufacturing Multilayer Wiring Board
- Publication number 20080116611
- Publication date May 22, 2008
- Sony Corporation
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer wiring board, semiconductor device mounting board using...
- Publication number 20050025944
- Publication date Feb 3, 2005
- Sony Corporation
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer wiring board, semiconductor device mounting board using...
- Publication number 20030180510
- Publication date Sep 25, 2003
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device built-in multilayer wiring board and method of...
- Publication number 20030178726
- Publication date Sep 25, 2003
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR