Hirosaku Nagano

Person

Ohtsu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer structure and multilayer wiring board using the same
- Patent number 7,252,881
- Issue date Aug 7, 2007
- Kaneka Corporation
- Takashi Itoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid polymer electrolyte membrane, solid polymer electrolyte fuel...
- Patent number 7,011,905
- Issue date Mar 14, 2006
- Sanyo Electric Co., LTD
- Shigeru Sakamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Copper foil with insulating adhesive
- Patent number 6,773,809
- Issue date Aug 10, 2004
- Kaneka Corporation
- Takashi Itoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally fusible adhesive copolymer, articles made therefrom, and...
- Patent number 5,932,345
- Issue date Aug 3, 1999
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Hiroyuki Furutani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of improving adhesive property of polyimide film and polymid...
- Patent number 5,861,192
- Issue date Jan 19, 1999
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Masao Nakata
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Laminate
- Patent number 5,759,693
- Issue date Jun 2, 1998
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Hiroyuki Tsuji
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermoplastic polyimide, polyamide acid, and thermally fusible lami...
- Patent number 5,668,247
- Issue date Sep 16, 1997
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Hiroyuki Furutani
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyimide film and manufacturing method thereof
- Patent number 5,665,802
- Issue date Sep 9, 1997
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Haruhiko Maki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and method of manufacturing it from...
- Patent number 5,641,852
- Issue date Jun 24, 1997
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Hiroyuki Tsuji
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermoplastic polyimide polymer; thermoplastic polyimide film; poly...
- Patent number 5,621,068
- Issue date Apr 15, 1997
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Yoshifumi Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for producing flexible printed circuit board
- Patent number 5,167,985
- Issue date Dec 1, 1992
- Kanegafuchi Kagaku Kogyo K.K.
- Hiroshi Ito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide having excellent thermal dimensional stability
- Patent number 5,081,229
- Issue date Jan 14, 1992
- Kanegafuchi Chemical Ind. Co., Ltd.
- Kiyokazu Akahori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide film
- Patent number 5,070,181
- Issue date Dec 3, 1991
- Kanegafuchi Chemical Ind. Co., Ltd.
- Hideki Kawai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process and apparatus for manufacturing polymers
- Patent number 5,066,770
- Issue date Nov 19, 1991
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Takehiko Noguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for continuous mixing of a two-liquid curing type resin
- Patent number 5,026,820
- Issue date Jun 25, 1991
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Takehiko Noguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Polyimide having excellent thermal dimensional stability
- Patent number 4,886,874
- Issue date Dec 12, 1989
- Kanegafuchi Chemical Ind. Co., Ltd.
- Hirosaku Nagano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide film and process for producing same
- Patent number 4,742,099
- Issue date May 3, 1988
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Hirosaku Nagano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin composition comprising modified polyamide-imid...
- Patent number 4,451,621
- Issue date May 29, 1984
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Kazuya Yonezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant polyamide-imide resin from polycarboxylic acid-polyi...
- Patent number 4,387,192
- Issue date Jun 7, 1983
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Kazuya Yonezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-resistant resin composition
- Patent number 4,362,826
- Issue date Dec 7, 1982
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Kazuya Yonezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Solid polymer electrolyte membrane, solid polymer electrolyte fuel...
- Publication number 20050181285
- Publication date Aug 18, 2005
- Sanyo Electric Co., Ltd.
- Shigeru Sakamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer structure and multilayer wiring board using the same
- Publication number 20030194573
- Publication date Oct 16, 2003
- Takashi Itoh
- B32 - LAYERED PRODUCTS

Hirosaku Nagano

Person

Patents Grantslast 30 patents

Multilayer structure and multilayer wiring board using the same

Solid polymer electrolyte membrane, solid polymer electrolyte fuel...

Copper foil with insulating adhesive

Thermally fusible adhesive copolymer, articles made therefrom, and...

Method of improving adhesive property of polyimide film and polymid...

Laminate

Thermoplastic polyimide, polyamide acid, and thermally fusible lami...

Polyimide film and manufacturing method thereof

Thermosetting resin composition and method of manufacturing it from...

Thermoplastic polyimide polymer; thermoplastic polyimide film; poly...

Process for producing flexible printed circuit board

Polyimide having excellent thermal dimensional stability

Polyimide film

Process and apparatus for manufacturing polymers

Process for continuous mixing of a two-liquid curing type resin

Polyimide having excellent thermal dimensional stability

Polyimide film and process for producing same

Heat resistant resin composition comprising modified polyamide-imid...

Heat resistant polyamide-imide resin from polycarboxylic acid-polyi...

Heat-resistant resin composition

Patents Applicationslast 30 patents

Solid polymer electrolyte membrane, solid polymer electrolyte fuel...

Multilayer structure and multilayer wiring board using the same