Hiroshi Akutsu

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Mohka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder ball container
- Patent number 6,352,153
- Issue date Mar 5, 2002
- Senju Metal Industry Co., Ltd.
- Fumio Ohashi
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL