Hiroshi Aoki

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Sugito, US

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Patents Grantslast 30 patents

Information Patent Grant
Bonding method and adhesive useful for the method
- Patent number 4,950,701
- Issue date Aug 21, 1990
- Cemedine Company, Ltd.
- Naomi Okamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...