Hiroshi Asami

Person

Shizuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,676,977
- Issue date Jun 13, 2023
- Sony Group Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,315,970
- Issue date Apr 26, 2022
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,050,074
- Issue date Aug 14, 2018
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, method of manufacturing circuit substrate, and e...
- Patent number 9,918,388
- Issue date Mar 13, 2018
- Sony Corporation
- Hiroshi Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,379,155
- Issue date Jun 28, 2016
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,041,179
- Issue date May 26, 2015
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, semiconductor element, semiconductor device, method...
- Patent number 8,987,899
- Issue date Mar 24, 2015
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,455,969
- Issue date Jun 4, 2013
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mount board and semiconductor module
- Patent number 8,263,871
- Issue date Sep 11, 2012
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,252,628
- Issue date Aug 28, 2012
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device incorporated substrate and method...
- Patent number 8,146,243
- Issue date Apr 3, 2012
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,939,360
- Issue date May 10, 2011
- Sony Corporation
- Hiroshi Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device-incorporated substrate
- Patent number 7,874,066
- Issue date Jan 25, 2011
- Sony Corporation
- Asami Hiroshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, semiconductor device employing same, and meth...
- Patent number 7,728,431
- Issue date Jun 1, 2010
- Sony Corporation
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating method and method of manufacturing semiconductor...
- Patent number 7,691,672
- Issue date Apr 6, 2010
- Sony Corporation
- Masaki Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer wiring substrate using temporary...
- Patent number 7,421,777
- Issue date Sep 9, 2008
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 7,420,127
- Issue date Sep 2, 2008
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 7,288,724
- Issue date Oct 30, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate device, method for producing the same, semiconduc...
- Patent number 7,138,294
- Issue date Nov 21, 2006
- Sony Corporation
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Junction structure and junction method for conductive projection
- Patent number 7,053,315
- Issue date May 30, 2006
- Sony Corporation
- Ken Orui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate device, method for producing the same, semiconduc...
- Patent number 6,831,357
- Issue date Dec 14, 2004
- Sony Corporation
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220231061
- Publication date Jul 21, 2022
- SONY GROUP CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190043905
- Publication date Feb 7, 2019
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160276385
- Publication date Sep 22, 2016
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150221690
- Publication date Aug 6, 2015
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND E...
- Publication number 20140191382
- Publication date Jul 10, 2014
- SONY CORPORATION
- Hiroshi Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140183680
- Publication date Jul 3, 2014
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120286387
- Publication date Nov 15, 2012
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, METHOD...
- Publication number 20120267778
- Publication date Oct 25, 2012
- SONY CORPORATION
- Hiroshi Asami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20120205817
- Publication date Aug 16, 2012
- SONY CORPORATION
- Hiroshi Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MA...
- Publication number 20110193223
- Publication date Aug 11, 2011
- SONY CORPORATION
- Hiroshi Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20100244270
- Publication date Sep 30, 2010
- SONY CORPORATION
- Hiroshi Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND SEMICONDUCTOR MODULE
- Publication number 20100122838
- Publication date May 20, 2010
- SONY CORPORATION
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE-INCORPORATED SUBSTRATE AND METHOD OF MANUFACTURING THEREOF A...
- Publication number 20090217518
- Publication date Sep 3, 2009
- SONY CORPORATION
- Asami Hiroshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090200629
- Publication date Aug 13, 2009
- SONY CORPORATION
- Hiroshi Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20080283951
- Publication date Nov 20, 2008
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUAFCTURING THE SAME
- Publication number 20080224249
- Publication date Sep 18, 2008
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20070293038
- Publication date Dec 20, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component, semiconductor device employing same, and meth...
- Publication number 20070290343
- Publication date Dec 20, 2007
- Sony Corporation
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate treating method and method of manufacturing semiconductor...
- Publication number 20070287265
- Publication date Dec 13, 2007
- Sony Corporation
- Masaki Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20070102191
- Publication date May 10, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component mounting method and component-mounted body
- Publication number 20070057022
- Publication date Mar 15, 2007
- Sony Corporation
- Keiichi Mogami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for manufacturing board with built-in device and board with...
- Publication number 20060124345
- Publication date Jun 15, 2006
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20050142852
- Publication date Jun 30, 2005
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Junction structure and junction method for conductive projection
- Publication number 20050056445
- Publication date Mar 17, 2005
- Ken Orui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate device, method for producing the same, semiconduc...
- Publication number 20040171190
- Publication date Sep 2, 2004
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20040003494
- Publication date Jan 8, 2004
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate device, method for producing the same, semiconduc...
- Publication number 20030214027
- Publication date Nov 20, 2003
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hiroshi Asami

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Circuit substrate, method of manufacturing circuit substrate, and e...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Circuit board, semiconductor element, semiconductor device, method...

Semiconductor device and method for manufacturing the same

Mount board and semiconductor module

Semiconductor device and method of manufacturing the same

Method of manufacturing a device incorporated substrate and method...

Semiconductor device and manufacturing method therefor

Method of manufacturing a device-incorporated substrate

Electronic component, semiconductor device employing same, and meth...

Substrate treating method and method of manufacturing semiconductor...

Method of manufacturing multilayer wiring substrate using temporary...

Method of manufacturing multilayer wiring substrate, and multilayer...

Method of manufacturing multilayer wiring substrate, and multilayer...

Circuit substrate device, method for producing the same, semiconduc...

Junction structure and junction method for conductive projection

Circuit substrate device, method for producing the same, semiconduc...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT SUBSTRATE, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND E...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD, SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, METHOD...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MA...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

MOUNT BOARD AND SEMICONDUCTOR MODULE

DEVICE-INCORPORATED SUBSTRATE AND METHOD OF MANUFACTURING THEREOF A...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUAFCTURING THE SAME

Method of manufacturing multilayer wiring substrate, and multilayer...

Electronic component, semiconductor device employing same, and meth...

Substrate treating method and method of manufacturing semiconductor...

Method of manufacturing multilayer wiring substrate, and multilayer...

Component mounting method and component-mounted body

Method for manufacturing board with built-in device and board with...

Method of manufacturing multilayer wiring substrate, and multilayer...

Junction structure and junction method for conductive projection

Circuit substrate device, method for producing the same, semiconduc...

Method of manufacturing multilayer wiring substrate, and multilayer...

Circuit substrate device, method for producing the same, semiconduc...