Hiroshi FUJISAWA

Follow

Person

Ueda, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 9,865,497
- Issue date Jan 9, 2018
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20160197008
- Publication date Jul 7, 2016
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- H01 - BASIC ELECTRIC ELEMENTS