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Hiroshi Fukaya
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Hong Kong, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Dimple forming apparatus and dimple forming method
Patent number
8,208,223
Issue date
Jun 26, 2012
Sae Magnetics (H.K.) Ltd.
Canhua Chen
G11 - INFORMATION STORAGE
Information
Patent Grant
Soldering method and apparatus
Patent number
8,013,271
Issue date
Sep 6, 2011
SAE Magnetics (H. K.) Ltd.
Hiroshi Fukaya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Dimple forming apparatus and dimple forming method
Publication number
20100328820
Publication date
Dec 30, 2010
SAE MAGNETICS (H. K) LTD.
Canhua Chen
G11 - INFORMATION STORAGE
Information
Patent Application
Head stack assembly, manufacturing method thereof, and disk drive unit
Publication number
20070171578
Publication date
Jul 26, 2007
SAE MAGNETICS(H.K.) LTD.
Takehiro Kamigama
G11 - INFORMATION STORAGE