Hiroshi Furukawa

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Hiratsuka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a bonded SOI wafer
- Patent number 5,953,620
- Issue date Sep 14, 1999
- Komatsu Electronics Metals Co., Ltd.
- Hirotaka Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating direct-bonded semiconductor wafers
- Patent number 5,932,048
- Issue date Aug 3, 1999
- Komatsu Electronic Metals Co., Ltd.
- Hiroshi Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for peeling a bonded wafer
- Patent number 5,897,743
- Issue date Apr 27, 1999
- Komatsu Electronic Metals Co., Ltd.
- Kazuaki Fujimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Silicon-on-insulator substrate and a method for fabricating the same
- Patent number 5,770,511
- Issue date Jun 23, 1998
- Komatsu Electronic Metals Co., Ltd.
- Kei Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS