Hiroshi Haji

Person

Fukuaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting components containing body, manufacturing method of...
- Patent number 10,069,042
- Issue date Sep 4, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroshi Haji
- G01 - MEASURING TESTING
Information Patent Grant
Cultivation system
- Patent number 9,775,301
- Issue date Oct 3, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryuji Nagadome
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Plant cultivation system
- Patent number 9,433,158
- Issue date Sep 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryuji Nagadome
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Component bonding method, component laminating method and bonded co...
- Patent number 8,614,118
- Issue date Dec 24, 2013
- Panasonic Corporation
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 8,558,460
- Issue date Oct 15, 2013
- Panasonic Corporation
- Masaru Nonomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 8,450,933
- Issue date May 28, 2013
- Panasonic Corporation
- Masaru Nonomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Substrate processing method, semiconductor chip manufacturing metho...
- Patent number 8,288,284
- Issue date Oct 16, 2012
- Panasonic Corporation
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip pickup apparatus, chip pickup method, chip releasing device an...
- Patent number 8,192,578
- Issue date Jun 5, 2012
- Panasonic Corporation
- Hiroshi Haji
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for processing a substrate, method for manufacturing a semic...
- Patent number 8,158,494
- Issue date Apr 17, 2012
- Panasonic Corporation
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor chip and method for processi...
- Patent number 7,964,449
- Issue date Jun 21, 2011
- Panasonic Corporation
- Hiroshi Haji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for dividing semiconductor wafer and manufacturing method fo...
- Patent number 7,927,973
- Issue date Apr 19, 2011
- Panasonic Corporation
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus
- Patent number 7,797,820
- Issue date Sep 21, 2010
- Panasonic Corporation
- Satoshi Shida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating semiconductor chip
- Patent number 7,767,551
- Issue date Aug 3, 2010
- Panasonic Corporation
- Kiyoshi Arita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for semiconductor devices, and formation appar...
- Patent number 7,629,228
- Issue date Dec 8, 2009
- Panasonic Corporation
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor devices, arrangement determi...
- Patent number 7,488,668
- Issue date Feb 10, 2009
- Panasonic Corporation
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus and method of mounting elec...
- Patent number 7,409,761
- Issue date Aug 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting method
- Patent number 7,353,596
- Issue date Apr 8, 2008
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Shida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 7,243,420
- Issue date Jul 17, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus and electronic component mo...
- Patent number 7,222,774
- Issue date May 29, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting electronic parts onto a board
- Patent number 7,137,195
- Issue date Nov 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode member used in a plasma treating apparatus
- Patent number 7,138,034
- Issue date Nov 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Arita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treating apparatus, plasma treating method and method of man...
- Patent number 7,074,720
- Issue date Jul 11, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electronic part by solder position detection
- Patent number 7,059,043
- Issue date Jun 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting apparatus and electronic component mo...
- Patent number 7,033,842
- Issue date Apr 25, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus and electronic component mo...
- Patent number 7,025,244
- Issue date Apr 11, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting apparatus
- Patent number 6,874,225
- Issue date Apr 5, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,852,572
- Issue date Feb 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic parts on a board
- Patent number 6,839,960
- Issue date Jan 11, 2005
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting electronic parts
- Patent number 6,792,676
- Issue date Sep 21, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for surface treatment of silicon based substrate
- Patent number 6,784,112
- Issue date Aug 31, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING COMPONENTS CONTAINING BODY, MANUFACTURING METHOD OF...
- Publication number 20160138787
- Publication date May 19, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroshi HAJI
- F21 - LIGHTING
Information Patent Application
PLANT CULTIVATION SYSTEM
- Publication number 20150014440
- Publication date Jan 15, 2015
- PANASONIC CORPORATION
- Ryuji Nagadome
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
CULTIVATION SYSTEM
- Publication number 20150000191
- Publication date Jan 1, 2015
- Panasonic Corproation
- Ryuji Nagadome
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR CHIP MANUFACTURING METHO...
- Publication number 20120021608
- Publication date Jan 26, 2012
- PANASONIC CORPORATION
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20110277933
- Publication date Nov 17, 2011
- PANASONIC CORPORATION
- Masaru Nonomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20110273094
- Publication date Nov 10, 2011
- PANASONIC CORPORATION
- Masaru Nonomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE, METHOD FOR MANUFACTURING A SEMIC...
- Publication number 20110014777
- Publication date Jan 20, 2011
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP AND METHOD FOR PROCESSI...
- Publication number 20100055875
- Publication date Mar 4, 2010
- PANASONIC CORPORATION
- Hiroshi Haji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...
- Publication number 20090279995
- Publication date Nov 12, 2009
- PANASONIC CORPORATION
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING M...
- Publication number 20090202333
- Publication date Aug 13, 2009
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for dividing semiconductor wafer and manufacturing method fo...
- Publication number 20090197393
- Publication date Aug 6, 2009
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Bonding Method, Component Laminating Method And Bonded Co...
- Publication number 20090035892
- Publication date Feb 5, 2009
- Matsushita Electric Industrial Co. Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Semiconductor Chip
- Publication number 20090004780
- Publication date Jan 1, 2009
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Arita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component Pickup Method, Electronic Component Mounting M...
- Publication number 20090000109
- Publication date Jan 1, 2009
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component mounting apparatus and component mounting method
- Publication number 20080163481
- Publication date Jul 10, 2008
- Satoshi Shida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component Mounting Apparatus And method Of Mounting Elec...
- Publication number 20080104831
- Publication date May 8, 2008
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATING APPARATUS USING ATOMIC HYDROGEN
- Publication number 20080029197
- Publication date Feb 7, 2008
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20060201999
- Publication date Sep 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Parts packaging device and parts packaging method
- Publication number 20060185157
- Publication date Aug 24, 2006
- Satoshi Shida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for semiconductor devices, and formation appar...
- Publication number 20060024924
- Publication date Feb 2, 2006
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for semiconductor devices, arrangement determi...
- Publication number 20060019416
- Publication date Jan 26, 2006
- Kiyoshi Arita
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Apparatus and method for mounting electronic parts
- Publication number 20050108873
- Publication date May 26, 2005
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for mounting semiconductor chip and semiconductor chip-mount...
- Publication number 20050110161
- Publication date May 26, 2005
- Hiroyuki Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20050072831
- Publication date Apr 7, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20040205961
- Publication date Oct 21, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for mounting electronic parts
- Publication number 20040148769
- Publication date Aug 5, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20030177633
- Publication date Sep 25, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20030110623
- Publication date Jun 19, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer processing apparatus
- Publication number 20030082914
- Publication date May 1, 2003
- Yutaka Koma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for mounting electronic parts
- Publication number 20030029033
- Publication date Feb 13, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Wataru Hidese
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Haji

Person

Patents Grantslast 30 patents

Light-emitting components containing body, manufacturing method of...

Cultivation system

Plant cultivation system

Component bonding method, component laminating method and bonded co...

Plasma processing apparatus

Plasma processing apparatus

Substrate processing method, semiconductor chip manufacturing metho...

Chip pickup apparatus, chip pickup method, chip releasing device an...

Method for processing a substrate, method for manufacturing a semic...

Method for manufacturing semiconductor chip and method for processi...

Method for dividing semiconductor wafer and manufacturing method fo...

Component mounting apparatus

Method for fabricating semiconductor chip

Manufacturing method for semiconductor devices, and formation appar...

Manufacturing method for semiconductor devices, arrangement determi...

Electronic component mounting apparatus and method of mounting elec...

Component mounting method

Electronic component mounting method

Electronic component mounting apparatus and electronic component mo...

Method for mounting electronic parts onto a board

Electrode member used in a plasma treating apparatus

Plasma treating apparatus, plasma treating method and method of man...

Method for mounting an electronic part by solder position detection

Electronic component mounting apparatus and electronic component mo...

Electronic component mounting apparatus and electronic component mo...

Electronic component mounting apparatus

Method of manufacturing semiconductor device

Method for mounting electronic parts on a board

Apparatus and method for mounting electronic parts

Method for surface treatment of silicon based substrate

Patents Applicationslast 30 patents

LIGHT-EMITTING COMPONENTS CONTAINING BODY, MANUFACTURING METHOD OF...

PLANT CULTIVATION SYSTEM

CULTIVATION SYSTEM

SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR CHIP MANUFACTURING METHO...

PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS

METHOD FOR PROCESSING A SUBSTRATE, METHOD FOR MANUFACTURING A SEMIC...

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP AND METHOD FOR PROCESSI...

CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...

ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING M...

Method for dividing semiconductor wafer and manufacturing method fo...

Component Bonding Method, Component Laminating Method And Bonded Co...

Method for Fabricating Semiconductor Chip

Electronic Component Pickup Method, Electronic Component Mounting M...

Component mounting apparatus and component mounting method

Electronic Component Mounting Apparatus And method Of Mounting Elec...

SURFACE TREATING APPARATUS USING ATOMIC HYDROGEN

Electronic component mounting apparatus and electronic component mo...

Parts packaging device and parts packaging method

Manufacturing method for semiconductor devices, and formation appar...

Manufacturing method for semiconductor devices, arrangement determi...

Apparatus and method for mounting electronic parts

Method for mounting semiconductor chip and semiconductor chip-mount...

Electronic component mounting apparatus and electronic component mo...

Electronic component mounting apparatus and electronic component mo...

Apparatus and method for mounting electronic parts

Electronic component mounting apparatus and electronic component mo...

Electronic component mounting apparatus and electronic component mo...

Semiconductor wafer processing apparatus

Apparatus and method for mounting electronic parts