Hiroshi HAMASAKI

Person

Hiratsuka Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Gas concentration device, gas detection system, gas concentration m...
- Patent number 11,921,021
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- G01 - MEASURING TESTING
Information Patent Grant
Particle inspection system and driving method employed therein
- Patent number 10,533,934
- Issue date Jan 14, 2020
- Kabushiki Kaisha Toshiba
- Michihiko Nishigaki
- G01 - MEASURING TESTING
Information Patent Grant
Microanalysis chip
- Patent number 10,337,976
- Issue date Jul 2, 2019
- Kabushiki Kaisha Toshiba
- Michihiko Nishigaki
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor micro-analysis chip and method of manufacturing the same
- Patent number 10,281,429
- Issue date May 7, 2019
- Kabushiki Kaisha Toshiba
- Kentaro Kobayashi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor analysis chip and particle inspection method
- Patent number 10,113,947
- Issue date Oct 30, 2018
- Kabushiki Kaisha Toshiba
- Kentaro Kobayashi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Analysis package for detecting particles in a sample liquid
- Patent number 9,895,691
- Issue date Feb 20, 2018
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Analysis package for detecting particles in a sample liquid includi...
- Patent number 9,885,680
- Issue date Feb 6, 2018
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Analysis package for detecting particles in a sample liquid, and in...
- Patent number 9,770,714
- Issue date Sep 26, 2017
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method for manufacturing semiconductor light emitting device
- Patent number 9,306,141
- Issue date Apr 5, 2016
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing semiconductor light emitting device
- Patent number 9,105,828
- Issue date Aug 11, 2015
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing semiconductor light emitting device
- Patent number 8,852,976
- Issue date Oct 7, 2014
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor light emitting device
- Patent number 8,610,163
- Issue date Dec 17, 2013
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing semiconductor light emitting device
- Patent number 8,148,183
- Issue date Apr 3, 2012
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Optoelectronic conversion header, LSI package with interface module...
- Patent number RE41742
- Issue date Sep 21, 2010
- Kabushiki Kaisha Toshiba
- Hideto Furuyama
- 385 - Optical waveguides
Information Patent Grant
Optical module and manufacturing method of the same
- Patent number 7,775,727
- Issue date Aug 17, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing optical fiber positioning component, and optica...
- Patent number 7,771,130
- Issue date Aug 10, 2010
- Sumitomo Electric Industries, Ltd.
- Wataru Sakurai
- G02 - OPTICS
Information Patent Grant
LSI package provided with interface module
- Patent number 7,759,781
- Issue date Jul 20, 2010
- Kabushiki Kaisha Toshiba
- Hideto Furuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical transmission line holding member, optical module and mounti...
- Patent number 7,711,237
- Issue date May 4, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Grant
LSI package with interface module and interface module
- Patent number 7,667,982
- Issue date Feb 23, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LSI package provided with interface module, and transmission line h...
- Patent number 7,667,311
- Issue date Feb 23, 2010
- Kabushiki Kaisha Toshiba
- Hideto Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface module-mounted LSI package
- Patent number 7,554,806
- Issue date Jun 30, 2009
- Kabushiki Kaisha Toshiba
- Hideto Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LSI package provided with interface module
- Patent number 7,535,090
- Issue date May 19, 2009
- Kabuhsiki Kaisha Toshiba
- Hideto Furuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LSI package equipped with interface module, interface module and co...
- Patent number 7,489,514
- Issue date Feb 10, 2009
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical guide holding member and optical module
- Patent number 7,441,964
- Issue date Oct 28, 2008
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Grant
Optical semiconductor module and semiconductor device including the...
- Patent number 7,438,481
- Issue date Oct 21, 2008
- Kabushiki Kaisha Toshiba
- Hideo Numata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LSI package provided with interface module, and transmission line h...
- Patent number 7,411,282
- Issue date Aug 12, 2008
- Kabushiki Kaisha Toshiba
- Hideto Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing optical coupling part and optical coupling...
- Patent number 7,401,983
- Issue date Jul 22, 2008
- Sumitomo Electric Industries, Ltd.
- Wataru Sakurai
- G02 - OPTICS
Information Patent Grant
LSI package provided with interface module and method of mounting t...
- Patent number 7,394,665
- Issue date Jul 1, 2008
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame, optical coupling part using lead frame, and manufacturi...
- Patent number 7,364,369
- Issue date Apr 29, 2008
- Sumitomo Electric Industries, Ltd.
- Wataru Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic conversion header, LSI package with interface module...
- Patent number 7,352,935
- Issue date Apr 1, 2008
- Kabushiki Kaisha Toshiba
- Hideto Furuyama
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
GAS SENSOR SYSTEM
- Publication number 20240077451
- Publication date Mar 7, 2024
- Kabushiki Kaisha Toshiba
- Hiroshi HAMASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL SENSOR SYSTEM
- Publication number 20240077464
- Publication date Mar 7, 2024
- Kabushiki Kaisha Toshiba
- Yoshiaki SUGIZAKI
- G01 - MEASURING TESTING
Information Patent Application
GAS CONCENTRATION DEVICE, GAS DETECTION SYSTEM, GAS CONCENTRATION M...
- Publication number 20220307952
- Publication date Sep 29, 2022
- Kabushiki Kaisha Toshiba
- Hiroshi HAMASAKI
- G01 - MEASURING TESTING
Information Patent Application
CHEMICAL SENSOR MODULE AND METHOD FOR DETECTING HYDROPHOBIC TARGET...
- Publication number 20220276200
- Publication date Sep 1, 2022
- Kabushiki Kaisha Toshiba
- Yoshiaki SUGIZAKI
- G01 - MEASURING TESTING
Information Patent Application
ANALYSIS CHIP
- Publication number 20210096099
- Publication date Apr 1, 2021
- Aipore Inc.
- Kentaro Kobayashi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
DETECTION DEVICE, DETECTION METHOD, AND ELECTRODE WITH PROBE
- Publication number 20190064157
- Publication date Feb 28, 2019
- Kabushiki Kaisha Toshiba
- Takuya MIYAGAWA
- G01 - MEASURING TESTING
Information Patent Application
ANALYSIS CHIP
- Publication number 20180088081
- Publication date Mar 29, 2018
- Kabushiki Kaisha Toshiba
- Kentaro Kobayashi
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
PARTICLE INSPECTION SYSTEM AND DRIVING METHOD EMPLOYED THEREIN
- Publication number 20170122859
- Publication date May 4, 2017
- Kabushiki Kaisha Toshiba
- Michihiko NISHIGAKI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR MICRO-ANALYSIS CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170122905
- Publication date May 4, 2017
- Kabushiki Kaisha Toshiba
- Kentaro KOBAYASHI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR ANALYSIS CHIP AND PARTICLE INSPECTION METHOD
- Publication number 20170074824
- Publication date Mar 16, 2017
- Kabushiki Kaisha Toshiba
- Kentaro KOBAYASHI
- G01 - MEASURING TESTING
Information Patent Application
ANALYSIS PACKAGE
- Publication number 20160231265
- Publication date Aug 11, 2016
- Kabushiki Kaisha Toshiba
- Hiroshi HAMASAKI
- G01 - MEASURING TESTING
Information Patent Application
ANALYSIS PACKAGE
- Publication number 20160231262
- Publication date Aug 11, 2016
- Kabushiki Kaisha Toshiba
- Hiroshi HAMASAKI
- G01 - MEASURING TESTING
Information Patent Application
ANALYSIS PACKAGE
- Publication number 20160231263
- Publication date Aug 11, 2016
- Kabushiki Kaisha Toshiba
- Hiroshi HAMASAKI
- G01 - MEASURING TESTING
Information Patent Application
MICROANALYSIS CHIP
- Publication number 20160153935
- Publication date Jun 2, 2016
- Kabushiki Kaisha Toshiba
- Michihiko NISHIGAKI
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20150303361
- Publication date Oct 22, 2015
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20140329348
- Publication date Nov 6, 2014
- Hiroshi Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20140070264
- Publication date Mar 13, 2014
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20120153344
- Publication date Jun 21, 2012
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20110027921
- Publication date Feb 3, 2011
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSMISSION LINE HOLDING MEMBER, OPTICAL MODULE AND MOUNTI...
- Publication number 20090103864
- Publication date Apr 23, 2009
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Application
LSI PACKAGE WITH INTERFACE MODULE AND INTERFACE MODULE
- Publication number 20090040739
- Publication date Feb 12, 2009
- Hiroshi Hamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20080298745
- Publication date Dec 4, 2008
- Kabushiki Kaisha Toshiba
- Hiroshi HAMASAKI
- G02 - OPTICS
Information Patent Application
INTERFACE MODULE-MOUNTED LSI PACKAGE
- Publication number 20080192433
- Publication date Aug 14, 2008
- Hideto Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LSI PACKAGE PROVIDED WITH INTERFACE MODULE, AND TRANSMISSION LINE H...
- Publication number 20080185733
- Publication date Aug 7, 2008
- KABUSHIKI KAISHA TOSHIBA
- Hideto Furuyama
- G02 - OPTICS
Information Patent Application
Method of producing optical fiber positioning component, and optica...
- Publication number 20080138027
- Publication date Jun 12, 2008
- Wataru Sakurai
- G02 - OPTICS
Information Patent Application
Lead frame, optical coupling part using lead frame, and manufacturi...
- Publication number 20070212001
- Publication date Sep 13, 2007
- Wataru Sakurai
- G02 - OPTICS
Information Patent Application
Method for manufacturing optical coupling part and optical coupling...
- Publication number 20070165986
- Publication date Jul 19, 2007
- Wataru Sakurai
- G02 - OPTICS
Information Patent Application
OPTICAL GUIDE HOLDING MEMBER AND OPTICAL MODULE
- Publication number 20070081769
- Publication date Apr 12, 2007
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Application
LSI PACKAGE PROVIDED WITH INTERFACE MODULE
- Publication number 20070045868
- Publication date Mar 1, 2007
- KAUSHIKI KAISHA TOSHIBA
- HIDETO FURUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Member holding optical transmission line and optical module
- Publication number 20060291783
- Publication date Dec 28, 2006
- Hiroshi Hamasaki
- G02 - OPTICS

Hiroshi HAMASAKI

Person

Patents Grantslast 30 patents

Gas concentration device, gas detection system, gas concentration m...

Particle inspection system and driving method employed therein

Microanalysis chip

Semiconductor micro-analysis chip and method of manufacturing the same

Semiconductor analysis chip and particle inspection method

Analysis package for detecting particles in a sample liquid

Analysis package for detecting particles in a sample liquid includi...

Analysis package for detecting particles in a sample liquid, and in...

Method for manufacturing semiconductor light emitting device

Method for manufacturing semiconductor light emitting device

Method for manufacturing semiconductor light emitting device

Method for manufacturing semiconductor light emitting device

Method for manufacturing semiconductor light emitting device

Optoelectronic conversion header, LSI package with interface module...

Optical module and manufacturing method of the same

Method of producing optical fiber positioning component, and optica...

LSI package provided with interface module

Optical transmission line holding member, optical module and mounti...

LSI package with interface module and interface module

LSI package provided with interface module, and transmission line h...

Interface module-mounted LSI package

LSI package provided with interface module

LSI package equipped with interface module, interface module and co...

Optical guide holding member and optical module

Optical semiconductor module and semiconductor device including the...

LSI package provided with interface module, and transmission line h...

Method for manufacturing optical coupling part and optical coupling...

LSI package provided with interface module and method of mounting t...

Lead frame, optical coupling part using lead frame, and manufacturi...

Optoelectronic conversion header, LSI package with interface module...

Patents Applicationslast 30 patents

GAS SENSOR SYSTEM

CHEMICAL SENSOR SYSTEM

GAS CONCENTRATION DEVICE, GAS DETECTION SYSTEM, GAS CONCENTRATION M...

CHEMICAL SENSOR MODULE AND METHOD FOR DETECTING HYDROPHOBIC TARGET...

ANALYSIS CHIP

DETECTION DEVICE, DETECTION METHOD, AND ELECTRODE WITH PROBE

ANALYSIS CHIP

PARTICLE INSPECTION SYSTEM AND DRIVING METHOD EMPLOYED THEREIN

SEMICONDUCTOR MICRO-ANALYSIS CHIP AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR ANALYSIS CHIP AND PARTICLE INSPECTION METHOD

ANALYSIS PACKAGE

ANALYSIS PACKAGE

ANALYSIS PACKAGE

MICROANALYSIS CHIP

METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE

OPTICAL TRANSMISSION LINE HOLDING MEMBER, OPTICAL MODULE AND MOUNTI...

LSI PACKAGE WITH INTERFACE MODULE AND INTERFACE MODULE

OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME

INTERFACE MODULE-MOUNTED LSI PACKAGE

LSI PACKAGE PROVIDED WITH INTERFACE MODULE, AND TRANSMISSION LINE H...

Method of producing optical fiber positioning component, and optica...

Lead frame, optical coupling part using lead frame, and manufacturi...

Method for manufacturing optical coupling part and optical coupling...

OPTICAL GUIDE HOLDING MEMBER AND OPTICAL MODULE

LSI PACKAGE PROVIDED WITH INTERFACE MODULE

Member holding optical transmission line and optical module