Hiroshi Hidaka

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame and method for fabricating resin-encapsulated semiconduc...
- Patent number 6,645,792
- Issue date Nov 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device producing apparatus and method
- Patent number 6,081,978
- Issue date Jul 4, 2000
- Matsushita Electronics Corporation
- Masaki Utsumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead frame and method for fabricating resin-encapsulated semiconduc...
- Publication number 20030003628
- Publication date Jan 2, 2003
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS