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Hiroshi Honmou
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Tokyo, JP
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last 30 patents
Information
Patent Grant
Optical module
Patent number
6,212,212
Issue date
Apr 3, 2001
NEC Corporation
Hiroshi Honmou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical coupling circuit
Patent number
6,161,965
Issue date
Dec 19, 2000
NEC Corporation
Hiroshi Honmou
G02 - OPTICS
Information
Patent Grant
Optical semiconductor module and method for manufacturing same
Patent number
6,019,523
Issue date
Feb 1, 2000
NEC Corporation
Hiroshi Honmou
G02 - OPTICS
Information
Patent Grant
Light receiving device for use in optical fiber communications and...
Patent number
5,929,500
Issue date
Jul 27, 1999
NEC Corporation
Isao Yoneda
G02 - OPTICS
Information
Patent Grant
Method of evaluating an optical transmission path
Patent number
5,877,853
Issue date
Mar 2, 1999
NEC Corporation
Hiroshi Honmou
G01 - MEASURING TESTING
Information
Patent Grant
Coupling structure of optical fiber and optical semiconductor element
Patent number
5,717,803
Issue date
Feb 10, 1998
NEC Corporation
Isao Yoneda
G02 - OPTICS
Information
Patent Grant
Method for forming tip of array optical fiber using etching process
Patent number
5,662,817
Issue date
Sep 2, 1997
NEC Corporation
Hiroshi Honmou
G02 - OPTICS
Information
Patent Grant
Optical module having self-aligned optical element and optical wave...
Patent number
5,661,831
Issue date
Aug 26, 1997
NEC Corporation
Jun-Ichi Sasaki
G02 - OPTICS
Information
Patent Grant
Bump forming apparatus
Patent number
5,573,170
Issue date
Nov 12, 1996
NEC Corporation
Junichi Sasaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for forming a hemispherical microlens at the e...
Patent number
5,563,969
Issue date
Oct 8, 1996
NEC Corporation
Hiroshi Honmou
G02 - OPTICS
Information
Patent Grant
Optical coupling equipment for an optical semiconductor and an opti...
Patent number
5,392,372
Issue date
Feb 21, 1995
NEC Corporation
Kazuhiko Kurata
G02 - OPTICS
Information
Patent Grant
Method of forming bonding bumps by punching a metal ribbon
Patent number
5,275,970
Issue date
Jan 4, 1994
NEC Corporation
Masataka Itoh
H01 - BASIC ELECTRIC ELEMENTS