Hiroshi Horibe

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip mounting apparatus and semiconductor chip mounti...
- Patent number 10,978,420
- Issue date Apr 13, 2021
- Shinkawa Ltd.
- Yoshihito Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device which employs an interlayer insulating film of...
- Patent number 7,202,565
- Issue date Apr 10, 2007
- Renesas Technology Corp.
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,138,725
- Issue date Nov 21, 2006
- Renesas Technology Corp.
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding apparatus
- Patent number 6,787,927
- Issue date Sep 7, 2004
- Renesas Technology Corp.
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,600,218
- Issue date Jul 29, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Fumiaki Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,518,652
- Issue date Feb 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yasuki Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 6,112,969
- Issue date Sep 5, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 6,105,848
- Issue date Aug 22, 2000
- Mitsubishi Denki Kabushki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 5,838,071
- Issue date Nov 17, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...
- Publication number 20200251441
- Publication date Aug 6, 2020
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070145583
- Publication date Jun 28, 2007
- Renesas Technology Corp.
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050082659
- Publication date Apr 21, 2005
- RENESAS TECHNOLOGY CORP.
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050054188
- Publication date Mar 10, 2005
- RENESAS TECHNOLOGY CORP.
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and wire bonding apparatus
- Publication number 20050029679
- Publication date Feb 10, 2005
- Renesas Technology Corp.
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040262723
- Publication date Dec 30, 2004
- RENESAS TECHNOLOGY CORP.
- Zhikang Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030052394
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Fumiaki Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and wire bonding apparatus
- Publication number 20030042622
- Publication date Mar 6, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20020027279
- Publication date Mar 7, 2002
- Yasuki Takata
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Horibe

Person

Patents Grantslast 30 patents

Semiconductor chip mounting apparatus and semiconductor chip mounti...

Semiconductor device which employs an interlayer insulating film of...

Semiconductor device

Semiconductor device and wire bonding apparatus

Semiconductor device

Semiconductor package

Wire bonding apparatus

Wire bonding method, wire bonding apparatus and semiconductor devic...

Wire bonding method, wire bonding apparatus and semiconductor devic...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and wire bonding apparatus

Semiconductor device

Semiconductor device

Semiconductor device and wire bonding apparatus

Semiconductor package