Hiroshi HOZOJI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power module, power converter device, and electrically powered vehicle
- Patent number 11,139,748
- Issue date Oct 5, 2021
- Hitachi Astemo, Ltd.
- Kinya Nakatsu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Transformer and power converter
- Patent number 10,580,561
- Issue date Mar 3, 2020
- Hitachi, Ltd.
- Hiroshi Hozoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating substrate and semiconductor device using same
- Patent number 10,559,509
- Issue date Feb 11, 2020
- Hitachi Metals, Ltd.
- Hiroshi Hozoji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power module, power converter device, and electrically powered vehicle
- Patent number 10,348,214
- Issue date Jul 9, 2019
- Hitachi Automotive Systems, Ltd.
- Kinya Nakatsu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module, power converter device, and electrically powered vehicle
- Patent number 9,729,076
- Issue date Aug 8, 2017
- Hitachi Automotive Systems, Ltd.
- Kinya Nakatsu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module, power converter device, and electrically powered vehicle
- Patent number 9,407,163
- Issue date Aug 2, 2016
- Hitachi Automotive Systems, Ltd.
- Kinya Nakatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-sealed electronic control device
- Patent number 9,373,558
- Issue date Jun 21, 2016
- Hitachi, Ltd.
- Nobutake Tsuyuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring material and semiconductor module using the same
- Patent number 8,975,747
- Issue date Mar 10, 2015
- Hitachi, Ltd.
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module, power converter device, and electrically powered vehicle
- Patent number 8,946,567
- Issue date Feb 3, 2015
- Hitachi Automotive Systems, Ltd.
- Kinya Nakatsu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power semiconductor module and manufacturing method thereof
- Patent number 8,847,374
- Issue date Sep 30, 2014
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonding material comprising coated metal nanopartic...
- Patent number 8,821,676
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding material using metal particle
- Patent number 8,821,768
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor unit, power module, power semiconductor unit ma...
- Patent number 8,723,306
- Issue date May 13, 2014
- Hitachi Automotive Systems, Ltd.
- Nobutake Tsuyuno
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor power module, inverter, and method of manufacturing a...
- Patent number 8,472,188
- Issue date Jun 25, 2013
- Hitachi, Ltd.
- Keisuke Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for resin-encapsulated semiconductor device
- Patent number 8,313,983
- Issue date Nov 20, 2012
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device using LC module structure
- Patent number 8,050,037
- Issue date Nov 1, 2011
- Hitachi, Ltd.
- Nobutake Tsuyuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-resin-boned structured body and resin-encapsulated semiconduc...
- Patent number 7,964,975
- Issue date Jun 21, 2011
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature bonding material comprising metal particles and bon...
- Patent number 7,955,411
- Issue date Jun 7, 2011
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor unit, and power conversion system and on-vehicle elec...
- Patent number 7,816,786
- Issue date Oct 19, 2010
- Hitachi, Ltd.
- Kinya Nakatsu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Inverter and vehicle drive unit using the same
- Patent number 7,589,400
- Issue date Sep 15, 2009
- Hitachi, Ltd.
- Hiroshi Hozoji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and power conversion apparatus using the same
- Patent number 7,542,317
- Issue date Jun 2, 2009
- Hitachi, Ltd.
- Katsunori Azuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, power converter device using it, and hybrid v...
- Patent number 7,528,485
- Issue date May 5, 2009
- Hitachi, Ltd.
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor unit, and power conversion system and on-vehicle elec...
- Patent number 7,504,720
- Issue date Mar 17, 2009
- Hitachi, Ltd.
- Kinya Nakatsu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic apparatus
- Patent number 7,425,762
- Issue date Sep 16, 2008
- Hitachi, Ltd.
- Takehiko Hasebe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting an electronic part on a substrate using a liqui...
- Patent number 7,393,771
- Issue date Jul 1, 2008
- Hitachi, Ltd.
- Hiroshi Hozoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, rubber product, and methods for manufacturing th...
- Patent number 7,172,130
- Issue date Feb 6, 2007
- Hitachi, Ltd.
- Shigeharu Tsunoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus
- Patent number 7,145,231
- Issue date Dec 5, 2006
- Hitachi, Ltd.
- Takehiko Hasebe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having projected electrodes and structure for...
- Patent number 7,084,498
- Issue date Aug 1, 2006
- Renesas Technology Corp.
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 7,057,283
- Issue date Jun 6, 2006
- Hitachi, Ltd.
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 7,002,250
- Issue date Feb 21, 2006
- Renesas Technology Corp.
- Hiroshi Hozoji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Module, Power Converter Device, and Electrically Powered Vehicle
- Publication number 20190393799
- Publication date Dec 26, 2019
- Hitachi Automotive Systems, Ltd.
- Kinya NAKATSU
- B60 - VEHICLES IN GENERAL
Information Patent Application
INSULATING SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20190221489
- Publication date Jul 18, 2019
- Hitachi Metals, Ltd.
- Hiroshi HOZOJI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TRANSFORMER AND POWER CONVERTER
- Publication number 20180005748
- Publication date Jan 4, 2018
- Hitachi, Ltd
- Hiroshi HOZOJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module, Power Converter Device, and Electrically Powered Vehicle
- Publication number 20170302191
- Publication date Oct 19, 2017
- Hitachi Automotive Systems, Ltd.
- Kinya NAKATSU
- B60 - VEHICLES IN GENERAL
Information Patent Application
Power Module, Power Converter Device, and Electrically Powered Vehicle
- Publication number 20160308456
- Publication date Oct 20, 2016
- Hitachi Automotive Systems, Ltd.
- Kinya NAKATSU
- B60 - VEHICLES IN GENERAL
Information Patent Application
Power Module, Power Converter Device, and Electrically Powered Vehicle
- Publication number 20160149512
- Publication date May 26, 2016
- Hitachi Automotive Systems, Ltd.
- Kinya NAKATSU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
RESIN-SEALED ELECTRONIC CONTROL DEVICE
- Publication number 20160005671
- Publication date Jan 7, 2016
- Hitachi, Ltd
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module
- Publication number 20150221626
- Publication date Aug 6, 2015
- Hitachi Power Semiconductor Device, Ltd.
- Shigehisa MOTOWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING MATERIAL AND SEMICONDUCTOR MODULE USING THE SAME
- Publication number 20140191399
- Publication date Jul 10, 2014
- Hitachi, Ltd.
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Manufacturing Method Thereof
- Publication number 20130175678
- Publication date Jul 11, 2013
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Unit, Power Module, Power Semiconductor Unit Ma...
- Publication number 20130119525
- Publication date May 16, 2013
- Hitachi Automotive Systems, Ltd.
- Nobutake Tsuyuno
- B60 - VEHICLES IN GENERAL
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
- Publication number 20130119322
- Publication date May 16, 2013
- Hitachi Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20120104618
- Publication date May 3, 2012
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Module, Power Converter Device, and Electrically Powered Vehicle
- Publication number 20110299265
- Publication date Dec 8, 2011
- Kinya Nakatsu
- B60 - VEHICLES IN GENERAL
Information Patent Application
FABRICATION METHOD FOR RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE
- Publication number 20110223720
- Publication date Sep 15, 2011
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20110204125
- Publication date Aug 25, 2011
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156225
- Publication date Jun 30, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroshi Hozoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A...
- Publication number 20100208427
- Publication date Aug 19, 2010
- Hitachi, Ltd.
- Keisuke Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-resin-boned structured body and resin-encapsulated semiconduc...
- Publication number 20090197375
- Publication date Aug 6, 2009
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Unit, and Power Conversion System and On-Vehicle Elec...
- Publication number 20090160048
- Publication date Jun 25, 2009
- HITACHI, LTD.
- Kinya Nakatsu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC CONTROL DEVICE USING LC MODULE STRUCTURE
- Publication number 20090086437
- Publication date Apr 2, 2009
- Hitachi, Ltd.
- Nobutake Tsuyuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20090008128
- Publication date Jan 8, 2009
- Takehiko Hasebe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20080173398
- Publication date Jul 24, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...
- Publication number 20080160183
- Publication date Jul 3, 2008
- Eiichi Ide
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE
- Publication number 20080156398
- Publication date Jul 3, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUI...
- Publication number 20070216012
- Publication date Sep 20, 2007
- HITACHI, LTD.
- Hiroshi Hozoji
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor bulk resistance element
- Publication number 20070200199
- Publication date Aug 30, 2007
- Susumu Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor unit, and power conversion system and on-vehicle elec...
- Publication number 20070096278
- Publication date May 3, 2007
- Hitachi, Ltd
- Kinya Nakatsu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Electronic apparatus
- Publication number 20070080447
- Publication date Apr 12, 2007
- Takehiko Hasebe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hiroshi HOZOJI

Person

Patents Grantslast 30 patents

Power module, power converter device, and electrically powered vehicle

Transformer and power converter

Insulating substrate and semiconductor device using same

Power module, power converter device, and electrically powered vehicle

Power module, power converter device, and electrically powered vehicle

Power module, power converter device, and electrically powered vehicle

Resin-sealed electronic control device

Wiring material and semiconductor module using the same

Power module, power converter device, and electrically powered vehicle

Power semiconductor module and manufacturing method thereof

Low temperature bonding material comprising coated metal nanopartic...

Bonding method and bonding material using metal particle

Power semiconductor unit, power module, power semiconductor unit ma...

Semiconductor power module, inverter, and method of manufacturing a...

Fabrication method for resin-encapsulated semiconductor device

Electronic control device using LC module structure

Metal-resin-boned structured body and resin-encapsulated semiconduc...

Low temperature bonding material comprising metal particles and bon...

Semiconductor unit, and power conversion system and on-vehicle elec...

Inverter and vehicle drive unit using the same

Semiconductor device and power conversion apparatus using the same

Semiconductor device, power converter device using it, and hybrid v...

Semiconductor unit, and power conversion system and on-vehicle elec...

Electronic apparatus

Method for mounting an electronic part on a substrate using a liqui...

Electronic device, rubber product, and methods for manufacturing th...

Electronic apparatus

Semiconductor device having projected electrodes and structure for...

Semiconductor device and method for producing the same

Semiconductor module

Patents Applicationslast 30 patents

Power Module, Power Converter Device, and Electrically Powered Vehicle

INSULATING SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME

TRANSFORMER AND POWER CONVERTER

Power Module, Power Converter Device, and Electrically Powered Vehicle

Power Module, Power Converter Device, and Electrically Powered Vehicle

Power Module, Power Converter Device, and Electrically Powered Vehicle

RESIN-SEALED ELECTRONIC CONTROL DEVICE

Power Semiconductor Module

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

WIRING MATERIAL AND SEMICONDUCTOR MODULE USING THE SAME

Power Semiconductor Module and Manufacturing Method Thereof

Power Semiconductor Unit, Power Module, Power Semiconductor Unit Ma...

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

Power Module, Power Converter Device, and Electrically Powered Vehicle

FABRICATION METHOD FOR RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A...

Metal-resin-boned structured body and resin-encapsulated semiconduc...

Semiconductor Unit, and Power Conversion System and On-Vehicle Elec...

ELECTRONIC CONTROL DEVICE USING LC MODULE STRUCTURE

ELECTRONIC APPARATUS

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...

BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUI...

Semiconductor bulk resistance element

Semiconductor unit, and power conversion system and on-vehicle elec...

Electronic apparatus