HIROSHI IIMURA

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KAWASAKI-SHI, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component package, printed circuit board, and method of...
- Patent number 6,727,718
- Issue date Apr 27, 2004
- Fujistu Limited
- Yasuhiro Ichihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package, printing circuit board, and method of...
- Patent number 6,498,307
- Issue date Dec 24, 2002
- Fujitsu Limited
- Yasuhiro Ichihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 5,783,865
- Issue date Jul 21, 1998
- Fujitsu Limited
- Yutaka Higashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device mounting board
- Patent number 5,760,469
- Issue date Jun 2, 1998
- Fujitsu Limited
- Yutaka Higashiguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic component package, printed circuit board, and method of...
- Publication number 20030063448
- Publication date Apr 3, 2003
- FUJITSU LIMITED
- YASUHIRO ICHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE, PRINTING CIRCUIT BOARD, AND METHOD OF...
- Publication number 20010030057
- Publication date Oct 18, 2001
- FUJITSU LIMITED
- YASUHIRO ICHIHARA
- H01 - BASIC ELECTRIC ELEMENTS