Hiroshi Inoguchi

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multi wire bonding with current sensing method
- Patent number 11,519,943
- Issue date Dec 6, 2022
- Semiconductor Components Industries, LLC
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe systems and related methods
- Patent number 11,101,197
- Issue date Aug 24, 2021
- Semiconductor Components Industries, LLC
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with efficient heat dissipation for semiconductor device...
- Patent number 10,361,148
- Issue date Jul 23, 2019
- Semiconductor Components Industries, LLC
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture an electric circuit
- Patent number 9,699,915
- Issue date Jul 4, 2017
- Semiconductor Components Industries, LLC
- Hiroshi Inoguchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Circuit device and method of manufacturing the same
- Patent number 7,531,785
- Issue date May 12, 2009
- Sanyo Electric Co., LTD
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device
- Patent number 7,317,199
- Issue date Jan 8, 2008
- Sanyo Electric Co., Ltd.
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,307,288
- Issue date Dec 11, 2007
- Sanyo Electric Co., LTD
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device
- Patent number 6,606,174
- Issue date Aug 12, 2003
- Sanyo Electric Co., LTD
- Tsutomu Ishikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical semiconductor device and optical semiconductor module equip...
- Patent number 6,252,252
- Issue date Jun 26, 2001
- Sanyo Electric Co., Ltd.
- Hideo Kunii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI WIRE BONDING WITH CURRENT SENSING METHOD
- Publication number 20220137102
- Publication date May 5, 2022
- Semiconductor Components Industries, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR THERMAL RESPONSE CONTROL FOR INTEGRATED CIRCUITS
- Publication number 20210320054
- Publication date Oct 14, 2021
- Semiconductor Components Industries, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SYSTEMS AND RELATED METHODS
- Publication number 20200312748
- Publication date Oct 1, 2020
- Semiconductor Components Industries, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT AND METHOD OF MANUFACTURE
- Publication number 20160105964
- Publication date Apr 14, 2016
- Semiconductor Components Industries, LLC
- Hiroshi Inoguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit device and method of manufacturing the same
- Publication number 20070001102
- Publication date Jan 4, 2007
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit device
- Publication number 20050248009
- Publication date Nov 10, 2005
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050093129
- Publication date May 5, 2005
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Inoguchi

Person

Patents Grantslast 30 patents

Multi wire bonding with current sensing method

Leadframe systems and related methods

Leadframe with efficient heat dissipation for semiconductor device...

Method of manufacture an electric circuit

Circuit device and method of manufacturing the same

Circuit device

Semiconductor device and manufacturing method thereof

Optical semiconductor device

Optical semiconductor device and optical semiconductor module equip...

Patents Applicationslast 30 patents

MULTI WIRE BONDING WITH CURRENT SENSING METHOD

HEATSINK FOR THERMAL RESPONSE CONTROL FOR INTEGRATED CIRCUITS

LEADFRAME SYSTEMS AND RELATED METHODS

ELECTRIC CIRCUIT AND METHOD OF MANUFACTURE

Circuit device and method of manufacturing the same

Circuit device

Semiconductor device and manufacturing method thereof