Hiroshi ISHINO

Person

Kariya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,996,344
- Issue date May 28, 2024
- Denso Corporation
- Shoichiro Omae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,908,778
- Issue date Feb 20, 2024
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of chips between two heat sinks
- Patent number 11,817,429
- Issue date Nov 14, 2023
- Denso Corporation
- Noriyuki Kakimoto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and maunfacturing method of semiconductor device
- Patent number 11,488,895
- Issue date Nov 1, 2022
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor chip connected with...
- Patent number 11,456,238
- Issue date Sep 27, 2022
- Denso Corporation
- Kosuke Kamiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,380,656
- Issue date Jul 5, 2022
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,535,577
- Issue date Jan 14, 2020
- Denso Corporation
- Hiroshi Ishino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 10,008,433
- Issue date Jun 26, 2018
- Denso Corporation
- Tomoo Morino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with bus bar including stacked wiring layers
- Patent number 9,905,541
- Issue date Feb 27, 2018
- Denso Corporation
- Hiroshi Ishino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power conversion device having two serially-connected switching ele...
- Patent number 9,729,044
- Issue date Aug 8, 2017
- Denso Corporation
- Hiroshi Ishino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module, semiconductor device having semiconductor mod...
- Patent number 9,520,345
- Issue date Dec 13, 2016
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device connection structure
- Patent number 9,351,423
- Issue date May 24, 2016
- Denso Corporation
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module, semiconductor device having semiconductor mod...
- Patent number 9,240,371
- Issue date Jan 19, 2016
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 8,598,458
- Issue date Dec 3, 2013
- Denso Corporation
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device including semiconduct...
- Patent number 8,309,434
- Issue date Nov 13, 2012
- Denso Corporation
- Yasutomi Asai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240421047
- Publication date Dec 19, 2024
- DENSO CORPORATION
- Hiroshi ISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347521
- Publication date Oct 17, 2024
- DENSO CORPORATION
- Yoshitaka KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240304560
- Publication date Sep 12, 2024
- DENSO CORPORATION
- Kazuki KUWATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20230411260
- Publication date Dec 21, 2023
- DENSO CORPORATION
- Kazuki KUWATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20230378031
- Publication date Nov 23, 2023
- DENSO CORPORATION
- Hiroshi ISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, ELECTRICAL COMPONENT, AND CONNECTION STRUCTUR...
- Publication number 20220415765
- Publication date Dec 29, 2022
- DENSO CORPORATION
- HIROSHI ISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MAUNFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20220068772
- Publication date Mar 3, 2022
- DENSO CORPORATION
- Hiroshi ISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210407892
- Publication date Dec 30, 2021
- DENSO CORPORATION
- Hiroshi ISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407875
- Publication date Dec 30, 2021
- DENSO CORPORATION
- Ryota MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407881
- Publication date Dec 30, 2021
- DENSO CORPORATION
- Shoichiro OMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210398951
- Publication date Dec 23, 2021
- DENSO CORPORATION
- NORIYUKI KAKIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210143088
- Publication date May 13, 2021
- DENSO CORPORATION
- Kosuke KAMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210057389
- Publication date Feb 25, 2021
- DENSO CORPORATION
- Hiroshi ISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190088568
- Publication date Mar 21, 2019
- Denso Corporation
- Hiroshi ISHINO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170162464
- Publication date Jun 8, 2017
- Denso Corporation
- Tomoo MORINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20170148770
- Publication date May 25, 2017
- Denso Corporation
- Hiroshi ISHINO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20160211741
- Publication date Jul 21, 2016
- Denso Corporation
- Hiroshi ISHINO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR MOD...
- Publication number 20160126167
- Publication date May 5, 2016
- DENSO CORPORATION
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE CONNECTION STRUCTURE
- Publication number 20150131232
- Publication date May 14, 2015
- Denso Corporation
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR MOD...
- Publication number 20140159216
- Publication date Jun 12, 2014
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110192630
- Publication date Aug 11, 2011
- DENSO CORPORATION
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20110033975
- Publication date Feb 10, 2011
- DENSO CORPORATION
- Yasutomi Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20070278550
- Publication date Dec 6, 2007
- DENSO CORPORATION
- Yasutomi Asai
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi ISHINO

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor module

Plurality of chips between two heat sinks

Semiconductor device and maunfacturing method of semiconductor device

Semiconductor device including a semiconductor chip connected with...

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor module with bus bar including stacked wiring layers

Power conversion device having two serially-connected switching ele...

Semiconductor module, semiconductor device having semiconductor mod...

Semiconductor device and semiconductor device connection structure

Semiconductor module, semiconductor device having semiconductor mod...

Electronic device and method of manufacturing the same

Method for manufacturing semiconductor device including semiconduct...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE, ELECTRICAL COMPONENT, AND CONNECTION STRUCTUR...

SEMICONDUCTOR DEVICE AND MAUNFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

POWER CONVERSION DEVICE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR MOD...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE CONNECTION STRUCTURE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR MOD...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same