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Hiroshi Ishiyama
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Aichi-pref., JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing semiconductor modules and semiconductor module
Patent number
8,629,004
Issue date
Jan 14, 2014
Denso Corporation
Daisuke Harada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic power converter and mounting structure of semiconductor...
Patent number
8,027,161
Issue date
Sep 27, 2011
Denso Corporation
Hiroshi Ishiyama
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Electric power converter and mounting structure of semiconductor de...
Patent number
7,826,226
Issue date
Nov 2, 2010
Denso Corporation
Hiroshi Ishiyama
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Electric power converter and mounting structure of semiconductor de...
Patent number
7,724,523
Issue date
May 25, 2010
Denso Corporation
Hiroshi Ishiyama
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Electric power converter and mounting structure of semiconductor de...
Patent number
7,508,668
Issue date
Mar 24, 2009
Denso Corporation
Daisuke Harada
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Power stack
Patent number
7,200,007
Issue date
Apr 3, 2007
Denso Corporation
Hidehiko Yasui
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Semiconductor module having inner pressure release portion
Patent number
7,190,054
Issue date
Mar 13, 2007
Denso Corporation
Hiroshi Ishiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor unit with cooling system
Patent number
7,015,578
Issue date
Mar 21, 2006
Denso Corporation
Shigenobu Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MODULES AND SEMICONDUCTOR MODULE
Publication number
20120001349
Publication date
Jan 5, 2012
Toyota Jidosha Kabushiki Kaisha
Daisuke HARADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic power converter and mounting structure of semiconductor...
Publication number
20090251859
Publication date
Oct 8, 2009
DENSO CORPORATION
Daisuke Harada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electric power converter and mounting structure of semiconductor de...
Publication number
20090251858
Publication date
Oct 8, 2009
DENSO CORPORATION
Daisuke Harada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electric power converter and mounting structure of semiconductor de...
Publication number
20080164607
Publication date
Jul 10, 2008
DENSO CORPORATION
Daisuke Harada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power converter and semiconductor device mounting structure
Publication number
20060284308
Publication date
Dec 21, 2006
Denso Corporation
Daisuke Harada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power stack
Publication number
20050259402
Publication date
Nov 24, 2005
DENSO CORPORATION
Hidehiko Yasui
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor unit with cooling system
Publication number
20050012206
Publication date
Jan 20, 2005
DENSO CORPORATION
Shigenobu Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor module having inner pressure release portion
Publication number
20040159962
Publication date
Aug 19, 2004
DENSO CORPORATION
Hiroshi Ishiyama
H01 - BASIC ELECTRIC ELEMENTS