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Hiroshi Koike
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Urawa, JP
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Patents Grants
last 30 patents
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Patent Grant
Pressure-sensitive adhesive sheet and covered structure
Patent number
6,827,997
Issue date
Dec 7, 2004
Lintec Corporation
Isao Sakurai
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Patent Grant
Cover tape for chip transportation and sealed structure
Patent number
6,171,672
Issue date
Jan 9, 2001
Lintec Corp.
Hiroshi Koike
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Pressure-sensitive adhesive sheet and covered structure
Publication number
20020155244
Publication date
Oct 24, 2002
Isao Sakurai
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...