Hiroshi Komorita

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polycrystalline aluminum nitride base material for crystal growth o...
- Patent number 9,356,101
- Issue date May 31, 2016
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Insulating substrate, manufacturing method thereof, and module semi...
- Patent number 7,263,766
- Issue date Sep 4, 2007
- Kabushiki Kaisha Toshiba
- Yutaka Ishiwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride wear resistant member and method of manufacturing t...
- Patent number 6,784,131
- Issue date Aug 31, 2004
- Kabushiki Kaisha Toshiba
- Michiyasu Komatsu
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Insulating substrate including multilevel insulative ceramic layers...
- Patent number 6,605,868
- Issue date Aug 12, 2003
- Kabushiki Kaisha Toshiba
- Yutaka Ishiwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Material for ceramic ball and method of manufacturing ceramic ball
- Patent number 6,485,830
- Issue date Nov 26, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Ceramic circuit board
- Patent number 6,426,154
- Issue date Jul 30, 2002
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride circuit board and semiconductor module
- Patent number 6,232,657
- Issue date May 15, 2001
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Silicon nitride circuit board
- Patent number 6,040,039
- Issue date Mar 21, 2000
- Kabushiki Kaisha Toshiba
- Kazuo Ikeda
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Silicon nitride circuit board
- Patent number 5,998,000
- Issue date Dec 7, 1999
- Kabushiki Kaisha Toshiba
- Kazuo Ikeda
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Silicon nitride circuit board
- Patent number 5,928,768
- Issue date Jul 27, 1999
- Kabushiki Kaisha Toshiba
- Kazuo Ikeda
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic circuit board
- Patent number 5,672,848
- Issue date Sep 30, 1997
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded ceramic-metal composite substrate, circuit board constructed...
- Patent number 5,363,278
- Issue date Nov 8, 1994
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board with a curved lead terminal
- Patent number 5,328,751
- Issue date Jul 12, 1994
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 5,280,850
- Issue date Jan 25, 1994
- Kabushiki Kaisha Toshiba
- Akihiro Horiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 5,176,309
- Issue date Jan 5, 1993
- Kabushiki Kaisha Toshiba
- Akihiro Horiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded ceramic-metal composite substrate, circuit board constructed...
- Patent number 5,155,665
- Issue date Oct 13, 1992
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded ceramic metal composite substrate, circuit board constructed...
- Patent number 4,987,677
- Issue date Jan 29, 1991
- Kabushiki Kaisha Toshiba
- Tadashi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded ceramic metal composite substrate, circuit board constructed...
- Patent number 4,959,507
- Issue date Sep 25, 1990
- Kabushiki Kaisha Toshiba
- Tadashi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joined ceramic-metal composite substrate and method for production...
- Patent number 4,954,386
- Issue date Sep 4, 1990
- Kabushiki Kaisha Toshiba
- Nobuyuki Mizunoya
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
POLYCRYSTALLINE ALUMINUM NITRIDE BASE MATERIAL FOR CRYSTAL GROWTH O...
- Publication number 20130168692
- Publication date Jul 4, 2013
- Toshiba Materials Co., Ltd.
- Hiroshi Komorita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Insulating substrate, manufacturing method thereof, and module semi...
- Publication number 20030168729
- Publication date Sep 11, 2003
- Kabushiki Kaisha Toshiba
- Yutaka Ishiwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon nitride wear resistant member and method of manufacturing t...
- Publication number 20020136908
- Publication date Sep 26, 2002
- Kabushiki Kaisha Toshiba
- Michiyasu Komatsu
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
INSULATING SUBSTRATE INCLUDING MULTILEVEL INSULATIVE CERAMIC LAYERS...
- Publication number 20020066953
- Publication date Jun 6, 2002
- YUTAKA ISHIWATA
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Komorita

Person

Patents Grantslast 30 patents

Polycrystalline aluminum nitride base material for crystal growth o...

Insulating substrate, manufacturing method thereof, and module semi...

Silicon nitride wear resistant member and method of manufacturing t...

Insulating substrate including multilevel insulative ceramic layers...

Material for ceramic ball and method of manufacturing ceramic ball

Ceramic circuit board

Silicon nitride circuit board and semiconductor module

Silicon nitride circuit board

Silicon nitride circuit board

Silicon nitride circuit board

Ceramic circuit board

Bonded ceramic-metal composite substrate, circuit board constructed...

Ceramic circuit board with a curved lead terminal

Method of manufacturing circuit board

Method of manufacturing circuit board

Bonded ceramic-metal composite substrate, circuit board constructed...

Bonded ceramic metal composite substrate, circuit board constructed...

Bonded ceramic metal composite substrate, circuit board constructed...

Joined ceramic-metal composite substrate and method for production...

Patents Applicationslast 30 patents

POLYCRYSTALLINE ALUMINUM NITRIDE BASE MATERIAL FOR CRYSTAL GROWTH O...

Insulating substrate, manufacturing method thereof, and module semi...

Silicon nitride wear resistant member and method of manufacturing t...

INSULATING SUBSTRATE INCLUDING MULTILEVEL INSULATIVE CERAMIC LAYERS...