Hiroshi Maki

Person

Kumagaya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus and manufacturing method for...
- Patent number 11,569,118
- Issue date Jan 31, 2023
- FASFORD TECHNOLOGY CO., LTD.
- Tsuyoshi Yokomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collet cleaning method and die bonder using the same
- Patent number 9,318,361
- Issue date Apr 19, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Yoshihide Ishii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die bonder and bonding method
- Patent number 8,991,681
- Issue date Mar 31, 2015
- Hitachi High-Tech Instuments Co., Ltd.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foreign substance removing device and die bonder equipped with the...
- Patent number 8,783,319
- Issue date Jul 22, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Takashi Yamagami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die bonder and bonding method
- Patent number 8,727,202
- Issue date May 20, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Nobuhisa Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,703,583
- Issue date Apr 22, 2014
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 8,640,943
- Issue date Feb 4, 2014
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tool management method of die bonder and die bonder
- Patent number 8,593,261
- Issue date Nov 26, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Susumu Takagi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,574,933
- Issue date Nov 5, 2013
- Renesas Electronics Corporation
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder, pickup method, and pickup device
- Patent number 8,561,664
- Issue date Oct 22, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Hiroshi Maki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method for semiconductor integrated device
- Patent number 8,492,173
- Issue date Jul 23, 2013
- Renesas Electonics Corporation
- Hiroshi Maki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 8,450,150
- Issue date May 28, 2013
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor integrated device
- Patent number 8,372,665
- Issue date Feb 12, 2013
- Renesas Electronics Corporation
- Hiroshi Maki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,367,433
- Issue date Feb 5, 2013
- Renesas Electronics Corporation
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 8,292,159
- Issue date Oct 23, 2012
- Renesas Eletronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor integrated device
- Patent number 8,222,050
- Issue date Jul 17, 2012
- Renesas Electronics Corporation
- Hiroshi Maki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor manufacturing method of die pick-up from wafer
- Patent number 8,211,261
- Issue date Jul 3, 2012
- Renesas Electronics Corporation
- Hiroshi Maki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 8,074,868
- Issue date Dec 13, 2011
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor integrated device
- Patent number 8,003,495
- Issue date Aug 23, 2011
- Renesas Electronics Corporation
- Hiroshi Maki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method for semiconductor integrated device
- Patent number 7,888,141
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Hiroshi Maki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,861,912
- Issue date Jan 4, 2011
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 7,824,932
- Issue date Nov 2, 2010
- Renesas Electronics Corporation
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method of die pick-up from wafer
- Patent number 7,759,164
- Issue date Jul 20, 2010
- Renesas Technology Corp.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,757,930
- Issue date Jul 20, 2010
- Renesas Technology Corp.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 7,629,231
- Issue date Dec 8, 2009
- Renesas Technology Corp.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method of die pick-up from wafer
- Patent number 7,498,241
- Issue date Mar 3, 2009
- Renesas Technology Corp.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication of semiconductor integrated circuit device
- Patent number 7,270,258
- Issue date Sep 18, 2007
- Renesas Technology Corp.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,115,482
- Issue date Oct 3, 2006
- Renesas Technology Corp.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,015,071
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Manufacturing Apparatus and Manufacturing Method for...
- Publication number 20230120615
- Publication date Apr 20, 2023
- Fasford Technology Co., Ltd.
- Tsuyoshi YOKOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Apparatus and Manufacturing Method for...
- Publication number 20200312699
- Publication date Oct 1, 2020
- Fasford Technology Co., Ltd.
- Tsuyoshi YOKOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Collet Cleaning Method and Die Bonder Using the Same
- Publication number 20140251535
- Publication date Sep 11, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Yoshihide ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130330879
- Publication date Dec 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20130299098
- Publication date Nov 14, 2013
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20130130408
- Publication date May 23, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130122615
- Publication date May 16, 2013
- RENESAS ELECTRONICS CORPORATION
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130068824
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Masayuki MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130071956
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Nobuhisa NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130068823
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130068826
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20120329211
- Publication date Dec 27, 2012
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20120270340
- Publication date Oct 25, 2012
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Foreign Substance Removing Device and Die Bonder Equipped with the...
- Publication number 20120241096
- Publication date Sep 27, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Takashi YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tool Management Method of Die Bonder and Die Bonder
- Publication number 20120075079
- Publication date Mar 29, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Susumu TAKAGI
- G05 - CONTROLLING REGULATING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20120058603
- Publication date Mar 8, 2012
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE
- Publication number 20110308738
- Publication date Dec 22, 2011
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20110290427
- Publication date Dec 1, 2011
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20110097849
- Publication date Apr 28, 2011
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110070696
- Publication date Mar 24, 2011
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20100285615
- Publication date Nov 11, 2010
- RENESAS TECHNOLOGY CORP.
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100279464
- Publication date Nov 4, 2010
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER
- Publication number 20100279465
- Publication date Nov 4, 2010
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100261312
- Publication date Oct 14, 2010
- RENESAS TECHNOLOGY CORP.
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Method of Semiconductor Device
- Publication number 20100055878
- Publication date Mar 4, 2010
- RENESAS TECHNOLOGY CORP.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090215204
- Publication date Aug 27, 2009
- RENESAS TECHNOLOGY CORP.
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER
- Publication number 20090170290
- Publication date Jul 2, 2009
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20080318346
- Publication date Dec 25, 2008
- RENESAS TECHNOLOGY CORP.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20080057599
- Publication date Mar 6, 2008
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20070287262
- Publication date Dec 13, 2007
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Maki

Person

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus and manufacturing method for...

Collet cleaning method and die bonder using the same

Die bonder and bonding method

Foreign substance removing device and die bonder equipped with the...

Die bonder and bonding method

Fabrication method of semiconductor device

Fabrication method of semiconductor integrated circuit device

Tool management method of die bonder and die bonder

Fabrication method of semiconductor device

Die bonder, pickup method, and pickup device

Manufacturing method for semiconductor integrated device

Manufacturing method of semiconductor integrated circuit device

Manufacturing method for semiconductor integrated device

Fabrication method of semiconductor device

Fabrication method of semiconductor integrated circuit device

Manufacturing method for semiconductor integrated device

Semiconductor manufacturing method of die pick-up from wafer

Fabrication method of semiconductor integrated circuit device

Manufacturing method for semiconductor integrated device

Manufacturing method for semiconductor integrated device

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor device

Semiconductor manufacturing method of die pick-up from wafer

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor device

Semiconductor manufacturing method of die pick-up from wafer

Method of fabrication of semiconductor integrated circuit device

Method of manufacturing semiconductor device

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

Semiconductor Manufacturing Apparatus and Manufacturing Method for...

Semiconductor Manufacturing Apparatus and Manufacturing Method for...

Collet Cleaning Method and Die Bonder Using the Same

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Die Bonder and Bonding Method

Die Bonder and Bonding Method

Die Bonder and Bonding Method

Die Bonder and Bonding Method

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

Foreign Substance Removing Device and Die Bonder Equipped with the...

Tool Management Method of Die Bonder and Die Bonder

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Fabrication Method of Semiconductor Device

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Fabrication method of semiconductor integrated circuit device