Hiroshi MAWATARI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Through electrode substrate and mounting substrate
- Patent number 12,119,293
- Issue date Oct 15, 2024
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, method of manufacturing through electr...
- Patent number 11,810,820
- Issue date Nov 7, 2023
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, method of manufacturing through electr...
- Patent number 11,373,906
- Issue date Jun 28, 2022
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, method of manufacturing through electr...
- Patent number 10,957,592
- Issue date Mar 23, 2021
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and manufacturing method thereof
- Patent number 10,755,996
- Issue date Aug 25, 2020
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural body and method for manufacturing same
- Patent number 9,924,596
- Issue date Mar 20, 2018
- Dai Nippon Printing Co., Ltd.
- Masaaki Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural body and method for manufacturing same
- Patent number 9,769,927
- Issue date Sep 19, 2017
- Dai Nippon Printing Co., Ltd.
- Masaaki Asano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...
- Publication number 20220328353
- Publication date Oct 13, 2022
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20220028772
- Publication date Jan 27, 2022
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...
- Publication number 20210175121
- Publication date Jun 10, 2021
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD OF THE WIRING BOARD
- Publication number 20200404781
- Publication date Dec 24, 2020
- DAI NIPPON PRINTING CO., LTD.
- Hiroki FURUSHOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...
- Publication number 20190287853
- Publication date Sep 19, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20190259696
- Publication date Aug 22, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20190080977
- Publication date Mar 14, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20170347451
- Publication date Nov 30, 2017
- DAI NIPPON PRINTING CO., LTD.
- Masaaki ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20170181280
- Publication date Jun 22, 2017
- DAI NIPPON PRINTING CO., LTD.
- Masaaki ASANO
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi MAWATARI

Person

Patents Grantslast 30 patents

Through electrode substrate and mounting substrate

Through electrode substrate, method of manufacturing through electr...

Through electrode substrate, method of manufacturing through electr...

Through electrode substrate, method of manufacturing through electr...

Through electrode substrate and manufacturing method thereof

Structural body and method for manufacturing same

Structural body and method for manufacturing same

Patents Applicationslast 30 patents

THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...

WIRING BOARD AND MANUFACTURING METHOD OF THE WIRING BOARD

THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

THROUGH ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF

STRUCTURAL BODY AND METHOD FOR MANUFACTURING SAME

STRUCTURAL BODY AND METHOD FOR MANUFACTURING SAME