Hiroshi Mikino

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Tachikawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor integrated circuit device, method for producing or as...
- Patent number 5,031,821
- Issue date Jul 16, 1991
- Hitachi, Ltd.
- Tsuyoshi Kaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 4,845,543
- Issue date Jul 4, 1989
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of providing semiconductor pellet with heat sink
- Patent number 4,123,293
- Issue date Oct 31, 1978
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-sealed type semiconductor devices and manufacturing method of...
- Patent number 4,100,566
- Issue date Jul 11, 1978
- Hitachi, Ltd.
- Susumu Okikawa
- H01 - BASIC ELECTRIC ELEMENTS