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Hiroshi Miyagawa
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Nagano-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing a wiring board by utilizing electro plating
Patent number
8,043,514
Issue date
Oct 25, 2011
Shinko Electric Industries Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device package, method of manufacturing the same, and...
Patent number
7,453,141
Issue date
Nov 18, 2008
Shinko Electric Industries Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing a wiring board by utilizing electro plating
Patent number
7,347,949
Issue date
Mar 25, 2008
Shinko Electric Industries, Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
6,110,755
Issue date
Aug 29, 2000
Shinko Electric Industries Co., Ltd.
Shigetsugu Muramatsu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of manufacturing a wiring board by utilizing electro plating
Publication number
20080116079
Publication date
May 22, 2008
Shinko Electric Industries Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor device package, method of manufacturing the same, and...
Publication number
20060189178
Publication date
Aug 24, 2006
Shinko Electric Industries Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of manufacturing a wiring board by utilizing electro plating
Publication number
20060016779
Publication date
Jan 26, 2006
Shinko Electric Industries Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR