Hiroshi Miyazaki

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Beppu-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multiple contact test probe
- Patent number 8,860,446
- Issue date Oct 14, 2014
- Texas Instruments Incorporated
- Hiroshi Miyazaki
- G01 - MEASURING TESTING
Information Patent Grant
Solder ball pad structure
- Patent number 7,294,929
- Issue date Nov 13, 2007
- Texas Instruments Incorporated
- Hiroshi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Leadframe-Based Semiconductor Package Having Terminals on Top and B...
- Publication number 20140210062
- Publication date Jul 31, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Hiroshi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CONTACT TEST PROBE
- Publication number 20130314114
- Publication date Nov 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Hiroshi Miyazaki
- G01 - MEASURING TESTING
Information Patent Application
Solder Ball Pad Structure
- Publication number 20080026559
- Publication date Jan 31, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Hiroshi Miyazaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder ball pad structure
- Publication number 20050146030
- Publication date Jul 7, 2005
- Hiroshi Miyazaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...