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Hiroshi Murai

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CHARGE/DISCHARGE DEVICE
    • Publication number 20210001739
    • Publication date Jan 7, 2021
    • Mitsubishi Electric Corporation
    • Hideyuki MURAI
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    BONDING WIRE
    • Publication number 20110058979
    • Publication date Mar 10, 2011
    • TANAKA DENSHI KOGYO K.K.
    • Hiroshi Murai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF...
    • Publication number 20100171222
    • Publication date Jul 8, 2010
    • TANAKA DENSHI KOGYO K.K.
    • Hiroshi Murai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Au Alloy Bonding Wire
    • Publication number 20080050267
    • Publication date Feb 28, 2008
    • Hiroshi Murai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Gold wire for semiconductor element connection and semiconductor el...
    • Publication number 20020007957
    • Publication date Jan 24, 2002
    • Hiroshi Murai
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...