Hiroshi Muto

Person

Nagoya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing movable portion of semiconductor device
- Patent number 7,214,625
- Issue date May 8, 2007
- Denso Corporation
- Kazushi Asami
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for producing the same by dicing
- Patent number 7,091,109
- Issue date Aug 15, 2006
- Denso Corporation
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,953,753
- Issue date Oct 11, 2005
- Denso Corporation
- Junji Oohara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device capable of sensing dyn...
- Patent number 6,906,394
- Issue date Jun 14, 2005
- Denso Corporation
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having a flat protective adhesive sheet
- Patent number 6,787,929
- Issue date Sep 7, 2004
- Denso Corporation
- Shinji Yoshihara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device capable of sensing dyn...
- Patent number 6,753,201
- Issue date Jun 22, 2004
- Denso Corporation
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,713,403
- Issue date Mar 30, 2004
- Denso Corporation
- Junji Oohara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor device and method of manufacturing the same
- Patent number 6,444,543
- Issue date Sep 3, 2002
- Denso Corporation
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device produced by dicing
- Patent number 6,429,506
- Issue date Aug 6, 2002
- Denso Corporation
- Tetsuo Fujii
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing semiconductor dynamic quantity sensor
- Patent number 6,287,885
- Issue date Sep 11, 2001
- Denso Corporation
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor physical quantity sensor having movable portion and f...
- Patent number 6,276,207
- Issue date Aug 21, 2001
- Denso Corporation
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with flat protective adhesive sheet and method...
- Patent number 6,245,593
- Issue date Jun 12, 2001
- Denso Corporation
- Shinji Yoshihara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor dynamical quantity sensor device having electrodes in...
- Patent number 6,151,966
- Issue date Nov 28, 2000
- Denso Corporation
- Minekazu Sakai
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing movable portion of semiconductor device
- Publication number 20050054153
- Publication date Mar 10, 2005
- DENSO Corporation
- Kazushi Asami
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method for producing the same by dicing
- Publication number 20040259330
- Publication date Dec 23, 2004
- Tetsuo Fujii
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of manufacturing semiconductor device capable of sensing dyn...
- Publication number 20030201506
- Publication date Oct 30, 2003
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20030176006
- Publication date Sep 18, 2003
- Junji Oohara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20030176071
- Publication date Sep 18, 2003
- Junji Oohara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing semiconductor device capable of sensing dyn...
- Publication number 20020177252
- Publication date Nov 28, 2002
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method for producing the same by dicing
- Publication number 20020093076
- Publication date Jul 18, 2002
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor sensor device and method of manufacturing the same
- Publication number 20010055876
- Publication date Dec 27, 2001
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device with flat protective adhesive sheet and method...
- Publication number 20010008300
- Publication date Jul 19, 2001
- IPICS Corporation
- Shinji Yoshihara
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Hiroshi Muto

Person

Patents Grantslast 30 patents

Method for manufacturing movable portion of semiconductor device

Semiconductor device and method for producing the same by dicing

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device capable of sensing dyn...

Semiconductor device having a flat protective adhesive sheet

Method of manufacturing semiconductor device capable of sensing dyn...

Method for manufacturing semiconductor device

Semiconductor sensor device and method of manufacturing the same

Semiconductor device produced by dicing

Method for manufacturing semiconductor dynamic quantity sensor

Semiconductor physical quantity sensor having movable portion and f...

Semiconductor device with flat protective adhesive sheet and method...

Semiconductor dynamical quantity sensor device having electrodes in...

Patents Applicationslast 30 patents

Method for manufacturing movable portion of semiconductor device

Semiconductor device and method for producing the same by dicing

Method of manufacturing semiconductor device capable of sensing dyn...

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device capable of sensing dyn...

Semiconductor device and method for producing the same by dicing

Semiconductor sensor device and method of manufacturing the same

Semiconductor device with flat protective adhesive sheet and method...