Hiroshi Nishikawa

Person

Omuta, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of using hexagonal system boron nitride powder
- Patent number 6,096,671
- Issue date Aug 1, 2000
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takashi Kawasaki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Hexagonal system boron nitride powder
- Patent number 5,854,155
- Issue date Dec 29, 1998
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takashi Kawasaki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Sintered product for making sheath used for continuous thin plate m...
- Patent number 5,227,347
- Issue date Jul 13, 1993
- Ishikawajima-Harima Jukogyo Kabushiki Kaisha
- Hisahiko Fukase
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Pressureless sintered body of boron nitride
- Patent number 5,063,184
- Issue date Nov 5, 1991
- Agency of Industrial Science and Technology
- Hagio Tsuyoshi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electrically conductive ceramic product and process for its production
- Patent number 4,795,723
- Issue date Jan 3, 1989
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hiroshi Nishikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor
- Patent number 4,529,755
- Issue date Jul 16, 1985
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hiroshi Nishikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hiroshi Nishikawa

Person

Patents Grantslast 30 patents

Method of using hexagonal system boron nitride powder

Hexagonal system boron nitride powder

Sintered product for making sheath used for continuous thin plate m...

Pressureless sintered body of boron nitride

Electrically conductive ceramic product and process for its production

Epoxy resin composition for encapsulating semiconductor