Hiroshi NORO

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Phosphor encapsulating sheet, light emitting diode device, and prod...
- Patent number 9,246,063
- Issue date Jan 26, 2016
- Nitto Denko Corporation
- Yuki Ebe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Encapsulating layer-covered optical semiconductor element, producin...
- Patent number 9,117,984
- Issue date Aug 25, 2015
- Nitto Denko Corporation
- Hiroyuki Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for optical semiconductor device and optica...
- Patent number 9,056,943
- Issue date Jun 16, 2015
- Nitto Denko Corporation
- Takahiro Uchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photocurable resin composition and optical component using the same
- Patent number 9,056,941
- Issue date Jun 16, 2015
- Nitto Denko Corporation
- Yukiko Higo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting encapsulation adhesive sheet
- Patent number 8,922,031
- Issue date Dec 30, 2014
- Nitto Denko Corporation
- Eiji Toyoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Light-curing resin composition and optical material
- Patent number 8,722,769
- Issue date May 13, 2014
- Nitto Denko Corporation
- Yukiko Higo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photocurable resin composition and optical component using the same
- Patent number 8,575,227
- Issue date Nov 5, 2013
- Nitto Denko Corporation
- Yukiko Higo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photocurable resin composition and optical component using the same
- Patent number 8,557,891
- Issue date Oct 15, 2013
- Nitto Denko Corporation
- Yukiko Higo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Resin composition for optical semiconductor device, optical-semicon...
- Patent number 8,319,228
- Issue date Nov 27, 2012
- Nitto Denko Corporation
- Takashi Taniguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition for optical components, optical component using t...
- Patent number 8,304,470
- Issue date Nov 6, 2012
- Nitto Denko Corporation
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation and semicon...
- Patent number 8,269,213
- Issue date Sep 18, 2012
- Nitto Denko Corporation
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for photosemiconductor element encapsulatio...
- Patent number 8,198,382
- Issue date Jun 12, 2012
- Nitto Denko Corporation
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminated sheet
- Patent number 7,521,122
- Issue date Apr 21, 2009
- Nitto Denko Corporation
- Hiroshi Noro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component unit
- Patent number 7,352,069
- Issue date Apr 1, 2008
- Nitto Denko Corporation
- Ichiro Hazeyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Resin composition for encapsulating semiconductor device
- Patent number 7,312,104
- Issue date Dec 25, 2007
- Nitto Denko Corporation
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and semiconductor device obtained w...
- Patent number 6,916,538
- Issue date Jul 12, 2005
- Nitto Denko Corporation
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and semiconductor device using the...
- Patent number 6,617,046
- Issue date Sep 9, 2003
- Nitto Denko Corporation
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for the production of semiconductor device
- Patent number 6,333,206
- Issue date Dec 25, 2001
- Nitto Denko Corporation
- Satoshi Ito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fabrication process of a semiconductor device
- Patent number 6,200,830
- Issue date Mar 13, 2001
- Nitto Denko Corporation
- Satoshi Ito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRODUCING METHOD OF ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEME...
- Publication number 20150179482
- Publication date Jun 25, 2015
- NITTO DENKO CORPORATION
- Munehisa Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCIN...
- Publication number 20140183593
- Publication date Jul 3, 2014
- Nitto Denko Corporation
- Hiroyuki KATAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICA...
- Publication number 20120299039
- Publication date Nov 29, 2012
- Nitto Denko Corporation
- Takahiro UCHIDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIGHT-CURING RESIN COMPOSITION AND OPTICAL MATERIAL
- Publication number 20120165424
- Publication date Jun 28, 2012
- NITTO DENKO CORPORATION
- Yukiko HIGO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING ENCAPSULATION ADHESIVE SHEET
- Publication number 20120153513
- Publication date Jun 21, 2012
- Nitto Denko Corporation
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME
- Publication number 20120010319
- Publication date Jan 12, 2012
- Nitto Denko Corporation
- Yukiko HIGO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME
- Publication number 20120010320
- Publication date Jan 12, 2012
- Nitto Denko Corporation
- Yukiko HIGO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION FOR OPTICAL USE, OPTICAL COMPONENT USING TH...
- Publication number 20110298003
- Publication date Dec 8, 2011
- Nitto Denko Corporation
- Takahiro UCHIDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT E...
- Publication number 20110201763
- Publication date Aug 18, 2011
- Nitto Denko Corporation
- Hiroshi NORO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL-SEMICON...
- Publication number 20110058776
- Publication date Mar 10, 2011
- NTTO DENKO CORPORATION
- Takashi TANIGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME
- Publication number 20100324164
- Publication date Dec 23, 2010
- Nitto Denko Corporation
- Yukiko HIGO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR OPTICAL COMPONENTS AND OPTICAL COMPONENT USIN...
- Publication number 20100292358
- Publication date Nov 18, 2010
- Nitto Denko Corporation
- Hiroshi NORO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATIO...
- Publication number 20100164127
- Publication date Jul 1, 2010
- NITTO DENKO CORPORATION
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20100148379
- Publication date Jun 17, 2010
- NITTO DENKO CORPORATION
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR PRODUCING OPTICAL COMPONENT
- Publication number 20090311630
- Publication date Dec 17, 2009
- Nitto Denko Corporation
- Hiroshi NORO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN COMPOSITION FOR OPTICAL COMPONENTS, OPTICAL COMPONENT USING T...
- Publication number 20090295003
- Publication date Dec 3, 2009
- NITTO DENKO DENKO CORPORATION
- Hiroshi NORO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090246918
- Publication date Oct 1, 2009
- Nitto Denko Corporation
- Hiroshi NORO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING ENCAPSULATION ADHESIVE SHEET
- Publication number 20080286562
- Publication date Nov 20, 2008
- Nitto Denko Corporation
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electronic component unit
- Publication number 20060103028
- Publication date May 18, 2006
- Nitto Denko Corporation
- Ichiro Hazeyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Resin composition for encapsulating semiconductor
- Publication number 20050158557
- Publication date Jul 21, 2005
- NITTO DENKO CORPORATION
- Hiroshi Noro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin composition for encapsulating semiconductor device
- Publication number 20050064201
- Publication date Mar 24, 2005
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Laminated sheet
- Publication number 20050008873
- Publication date Jan 13, 2005
- Hiroshi Noro
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermosetting resin composition and semiconductor device obtained w...
- Publication number 20030219619
- Publication date Nov 27, 2003
- NITTO DENKO CORPORATION
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and semiconductor device using the...
- Publication number 20020151106
- Publication date Oct 17, 2002
- Hiroshi Noro
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi NORO

Person

Patents Grantslast 30 patents

Phosphor encapsulating sheet, light emitting diode device, and prod...

Encapsulating layer-covered optical semiconductor element, producin...

Epoxy resin composition for optical semiconductor device and optica...

Photocurable resin composition and optical component using the same

Thermosetting encapsulation adhesive sheet

Light-curing resin composition and optical material

Photocurable resin composition and optical component using the same

Photocurable resin composition and optical component using the same

Resin composition for optical semiconductor device, optical-semicon...

Resin composition for optical components, optical component using t...

Epoxy resin composition for semiconductor encapsulation and semicon...

Epoxy resin composition for photosemiconductor element encapsulatio...

Laminated sheet

Electronic component unit

Resin composition for encapsulating semiconductor device

Thermosetting resin composition and semiconductor device obtained w...

Thermosetting resin composition and semiconductor device using the...

Process for the production of semiconductor device

Fabrication process of a semiconductor device

Patents Applicationslast 30 patents

PRODUCING METHOD OF ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEME...

ENCAPSULATING LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCIN...

EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICA...

LIGHT-CURING RESIN COMPOSITION AND OPTICAL MATERIAL

THERMOSETTING ENCAPSULATION ADHESIVE SHEET

PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME

PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME

EPOXY RESIN COMPOSITION FOR OPTICAL USE, OPTICAL COMPONENT USING TH...

THERMOSETTING RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT E...

RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL-SEMICON...

PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME

RESIN COMPOSITION FOR OPTICAL COMPONENTS AND OPTICAL COMPONENT USIN...

EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATIO...

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

PROCESS FOR PRODUCING OPTICAL COMPONENT

RESIN COMPOSITION FOR OPTICAL COMPONENTS, OPTICAL COMPONENT USING T...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

THERMOSETTING ENCAPSULATION ADHESIVE SHEET

Electronic component unit

Resin composition for encapsulating semiconductor

Resin composition for encapsulating semiconductor device

Laminated sheet

Thermosetting resin composition and semiconductor device obtained w...

Thermosetting resin composition and semiconductor device using the...