Hiroshi Ochi

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Ehime, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flip chip package, circuit board thereof and packaging method thereof
- Patent number 7,034,389
- Issue date Apr 25, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kenji Morimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package, circuit board thereof and packaging method thereof
- Patent number 6,750,132
- Issue date Jun 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kenji Morimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing ceramic multi-layered substrate
- Patent number 6,740,183
- Issue date May 25, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shigetoshi Segawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sheet retainer for punching ceramic green sheet and punching apparatus
- Patent number 6,647,845
- Issue date Nov 18, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Ochi
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Flip chip package, circuit board thereof and packaging method thereof
- Publication number 20040227253
- Publication date Nov 18, 2004
- Matsushita Elec. Ind. Co. Ltd.
- Kenji Morimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip package, circuit board thereof and packaging method thereof
- Publication number 20020175407
- Publication date Nov 28, 2002
- Kenji Morimoto
- H01 - BASIC ELECTRIC ELEMENTS