Hiroshi Odaira

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Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
Wiring circuit board, manufacturing method for the wiring circuit b...
- Publication number 20100242270
- Publication date Sep 30, 2010
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer wiring board, method for producing multi-layer wiring b...
- Publication number 20050097727
- Publication date May 12, 2005
- Tomoo Iijima
- B24 - GRINDING POLISHING
Information Patent Application
Wiring circuit board, manufacturing method for the wiring circuit b...
- Publication number 20040201096
- Publication date Oct 14, 2004
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR