Hiroshi Ohtani

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic substrate for semiconductor package and method of manufacture
- Patent number 4,472,333
- Issue date Sep 18, 1984
- Narumi China Corporation
- Hiroshi Ohtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate for semiconductor package
- Patent number 4,456,641
- Issue date Jun 26, 1984
- Narumi China Corporation
- Hiroshi Ohtani
- H01 - BASIC ELECTRIC ELEMENTS