Hiroshi Oishi

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Slicing method and wire saw apparatus
- Patent number 8,567,384
- Issue date Oct 29, 2013
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing method and method for manufacturing epitaxial wafer
- Patent number 8,210,906
- Issue date Jul 3, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B24 - GRINDING POLISHING
Information Patent Grant
Slicing method
- Patent number 8,167,681
- Issue date May 1, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of improving nanotopography of surface of wafer and wire saw...
- Patent number 7,997,262
- Issue date Aug 16, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slicing method
- Patent number 7,988,530
- Issue date Aug 2, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Double-disc grinding machine, static pressure pad, and double-disc...
- Patent number 7,887,394
- Issue date Feb 15, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing (110) silicon wafer
- Patent number 7,699,050
- Issue date Apr 20, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry useful for wire-saw slicing and evaluation of slurry
- Patent number 6,422,067
- Issue date Jul 23, 2002
- Super Silicon Crystal Research Institute Corporation
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire cleaning apparatus
- Patent number 6,261,166
- Issue date Jul 17, 2001
- Super Silicon Crystal Research Institute Corp.
- Keiichiro Asakawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire-sawing machine
- Patent number 6,237,585
- Issue date May 29, 2001
- Super Silicon Crystal Research Institute Corp.
- Hiroshi Oishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Abnormality transmission system for wire saw
- Patent number 6,234,160
- Issue date May 22, 2001
- Tokyo Seimitsu Co., Ltd.
- Shinji Nagatsuka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw control method and wire saw
- Patent number 6,178,961
- Issue date Jan 30, 2001
- Tokyo Seimitsu Co., Ltd.
- Shinji Nagatsuka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ingot slicing method and apparatus therefor
- Patent number 6,065,461
- Issue date May 23, 2000
- Super Silicon Crystal Research Institute Corp.
- Keiichiro Asakawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of slicing a workpiece through use of a wire saw, and a wire...
- Patent number 6,062,209
- Issue date May 16, 2000
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer having a laser mark on chamfered edge
- Patent number 6,004,405
- Issue date Dec 21, 1999
- Super Silicon Crystal Research Institute Corp.
- Hiroshi Oishi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Production of notchless wafer
- Patent number 5,993,292
- Issue date Nov 30, 1999
- Super Silicon Crystal Research Institute Corp.
- Hiroshi Oishi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of manufacturing semiconductor monocrystalline mirror-surfac...
- Patent number 5,981,392
- Issue date Nov 9, 1999
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
Method of improving nanotopography of surface of wafer and wire saw...
- Publication number 20100180880
- Publication date Jul 22, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLICING METHOD AND WIRE SAW APPARATUS
- Publication number 20100089377
- Publication date Apr 15, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Slicing method
- Publication number 20100037881
- Publication date Feb 18, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Slicing method and method for manufacturing epitaxial wafer
- Publication number 20090288530
- Publication date Nov 26, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Slicing Method
- Publication number 20090253352
- Publication date Oct 8, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method of Manufacturing (110) Silicon Wafer
- Publication number 20090084373
- Publication date Apr 2, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Double-Disc Grinding Machine, Static Pressure Pad, and Double-Disc...
- Publication number 20090053978
- Publication date Feb 26, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B24 - GRINDING POLISHING
Information Patent Application
Aqueous grinding fluid for wire-sawing or band-sawing
- Publication number 20030100455
- Publication date May 29, 2003
- Hiroshi Oishi
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...

Hiroshi Oishi

Person

Patents Grantslast 30 patents

Slicing method and wire saw apparatus

Slicing method and method for manufacturing epitaxial wafer

Slicing method

Method of improving nanotopography of surface of wafer and wire saw...

Slicing method

Double-disc grinding machine, static pressure pad, and double-disc...

Method of manufacturing (110) silicon wafer

Slurry useful for wire-saw slicing and evaluation of slurry

Wire cleaning apparatus

Wire-sawing machine

Abnormality transmission system for wire saw

Wire saw control method and wire saw

Ingot slicing method and apparatus therefor

Method of slicing a workpiece through use of a wire saw, and a wire...

Wafer having a laser mark on chamfered edge

Production of notchless wafer

Method of manufacturing semiconductor monocrystalline mirror-surfac...

Patents Applicationslast 30 patents

Method of improving nanotopography of surface of wafer and wire saw...

SLICING METHOD AND WIRE SAW APPARATUS

Slicing method

Slicing method and method for manufacturing epitaxial wafer

Slicing Method

Method of Manufacturing (110) Silicon Wafer

Double-Disc Grinding Machine, Static Pressure Pad, and Double-Disc...

Aqueous grinding fluid for wire-sawing or band-sawing