Hiroshi Okayama

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board
- Patent number 9,271,391
- Issue date Feb 23, 2016
- Waka Manufacturing Co., Ltd.
- Hiroshi Okayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20130313003
- Publication date Nov 28, 2013
- WAKA MANUFACTURING CO., LTD.
- Hiroshi Okayama
- H01 - BASIC ELECTRIC ELEMENTS