Hiroshi Seki

Person

Ota-Ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Switch
- Patent number 6,911,612
- Issue date Jun 28, 2005
- Niles Parts Co., Ltd
- Hiroshi Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple switch device
- Patent number 6,833,517
- Issue date Dec 21, 2004
- Niles Parts Co., Ltd
- Tsuyoshi Sotome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch
- Patent number 6,686,550
- Issue date Feb 3, 2004
- Niles Parts Co., Ltd
- Hiroshi Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,256,875
- Issue date Jul 10, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device laminated printed circuit boards
- Patent number 6,005,289
- Issue date Dec 21, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing inversion type IC's and IC module using same
- Patent number RE36077
- Issue date Feb 2, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- 351 - Optics: eye examining, vision testing and correcting
Information Patent Grant
Evaluation board for evaluating electrical characteristics of an IC...
- Patent number 5,672,965
- Issue date Sep 30, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Kazuhiko Kurafuchi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having particular power distribution interconn...
- Patent number 5,309,021
- Issue date May 3, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Haruo Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing inversion type IC's and IC module using same
- Patent number 5,303,120
- Issue date Apr 12, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated bonding packaged semiconductor device incorporating...
- Patent number 5,157,478
- Issue date Oct 20, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape including molten resin flow path element for resin pac...
- Patent number 5,064,706
- Issue date Nov 12, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor device
- Patent number 4,839,713
- Issue date Jun 13, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhiro Teraoka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor integrated circuit
- Publication number 20050007827
- Publication date Jan 13, 2005
- Hiroshi Seki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor integrated circuit
- Publication number 20050007176
- Publication date Jan 13, 2005
- Hiroshi Seki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Switch
- Publication number 20030042120
- Publication date Mar 6, 2003
- Hiroshi Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Switch
- Publication number 20030042124
- Publication date Mar 6, 2003
- Hiroshi Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple switch device
- Publication number 20010004044
- Publication date Jun 21, 2001
- Niles Part Co., Ltd.
- Tsuyoshi Sotome
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Seki

Person

Patents Grantslast 30 patents

Switch

Multiple switch device

Switch

Method for manufacturing semiconductor device

Package for semiconductor device laminated printed circuit boards

Method of manufacturing inversion type IC's and IC module using same

Evaluation board for evaluating electrical characteristics of an IC...

Semiconductor device having particular power distribution interconn...

Method of manufacturing inversion type IC's and IC module using same

Tape automated bonding packaged semiconductor device incorporating...

Carrier tape including molten resin flow path element for resin pac...

Package structure for semiconductor device

Patents Applicationslast 30 patents

Semiconductor integrated circuit

Semiconductor integrated circuit

Switch

Switch

Multiple switch device