Hiroshi Shimozawa

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Detergent, method of cleaning, and apparatus for cleaning
- Patent number 5,789,359
- Issue date Aug 4, 1998
- Kabushiki Kaisha Toshiba
- Hiroshi Shimozawa
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Thermosetting resin composition
- Patent number 5,637,667
- Issue date Jun 10, 1997
- Kabushiki Kaisha Toshiba
- Hiroshi Shimozawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition
- Patent number 5,438,113
- Issue date Aug 1, 1995
- Kabushiki Kaisha Toshiba
- Hiroshi Shimozawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Maleimide resin composition and resin encapsulated semiconductor de...
- Patent number 5,272,377
- Issue date Dec 21, 1993
- Kabushiki Kaisha Toshiba
- Hiroshi Shimozawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device encapsulant
- Patent number 5,258,426
- Issue date Nov 2, 1993
- Kabushiki Kaisha Toshiba
- Ken Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor device having waterproof cap
- Patent number 5,223,739
- Issue date Jun 29, 1993
- Kabushiki Kaisha Toshiba
- Akio Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulant consisting of epoxy resin composition
- Patent number 5,068,267
- Issue date Nov 26, 1991
- Kabushiki Kaisha Toshiba
- Ken Uchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hiroshi Shimozawa

Person

Patents Grantslast 30 patents

Detergent, method of cleaning, and apparatus for cleaning

Thermosetting resin composition

Thermosetting resin composition

Maleimide resin composition and resin encapsulated semiconductor de...

Semiconductor device encapsulant

Plastic molded semiconductor device having waterproof cap

Semiconductor device encapsulant consisting of epoxy resin composition