Hiroshi TAKAI

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for shape modification of polishing pad
- Patent number 9,073,173
- Issue date Jul 7, 2015
- Sumco Corporation
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer polishing method and polishing pad shaping jig
- Patent number 8,647,174
- Issue date Feb 11, 2014
- Sumco Corporation
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer manufacturing method
- Patent number 8,545,712
- Issue date Oct 1, 2013
- Sumco Techxiv Corporation
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad thickness measuring method and polishing pad thicknes...
- Patent number 8,296,961
- Issue date Oct 30, 2012
- Sumco Corporation
- Yuichi Nakayoshi
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for automatically feeding and packing surimi of fish or s...
- Patent number 5,113,635
- Issue date May 19, 1992
- Nippon Suisan Kaisha Ltd.
- Hiroshi Takai
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
CARRIER MEASUREMENT DEVICE, CARRIER MEASUREMENT METHOD, AND CARRIER...
- Publication number 20230384077
- Publication date Nov 30, 2023
- SUMCO CORPORATION
- Hiroshi TAKAI
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER POLISHING METHOD AND POLISHING PAD SHAPING JIG
- Publication number 20120028547
- Publication date Feb 2, 2012
- SUMCO CORPORATION
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR SHAPE MODIFICATION OF POLISHING PAD
- Publication number 20110171885
- Publication date Jul 14, 2011
- SUMCO CORPORATION
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER MANUFACTURING METHOD
- Publication number 20100285665
- Publication date Nov 11, 2010
- SUMCO TECHXIV CORPORATION
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD THICKNESS MEASURING METHOD AND POLISHING PAD THICKNES...
- Publication number 20100197197
- Publication date Aug 5, 2010
- SUMCO CORPORATION
- Yuichi NAKAYOSHI
- B24 - GRINDING POLISHING