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Hiroshi Takamichi
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Ube, JP
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last 30 patents
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Patent Grant
Method of forming connector structure for a ball-grid array
Patent number
6,199,273
Issue date
Mar 13, 2001
Sumitomo Metal Industries, Ltd.
Toshihiko Kubo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with improved moisture vapor relief function...
Patent number
6,054,755
Issue date
Apr 25, 2000
Sumitomo Metal (SMI) Electronics Devices Inc.
Hiroshi Takamichi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package using an aluminum nitride substrate
Patent number
5,463,248
Issue date
Oct 31, 1995
Kabushiki Kaisha Toshiba
Keiichi Yano
H01 - BASIC ELECTRIC ELEMENTS