Hiroshi Takei

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Anjo-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate package structure and packaging method thereof
- Patent number 7,405,478
- Issue date Jul 29, 2008
- Denso Corporation
- Katsumi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and semiconductor device
- Patent number 7,285,854
- Issue date Oct 23, 2007
- Denso Corporation
- Katsumi Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Substrate package structure and packaging method thereof
- Publication number 20060113668
- Publication date Jun 1, 2006
- DENSO CORPORATION
- Katsumi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and semiconductor device
- Publication number 20050205995
- Publication date Sep 22, 2005
- DENSO Corporation
- Katsumi Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR