TREA

Hiroshi TANEDA

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  • Nagano, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring substrate and semiconductor device
    • Patent number 12,057,384
    • Issue date Aug 6, 2024
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi Taneda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interconnect substrate
    • Patent number 11,792,927
    • Issue date Oct 17, 2023
    • Shinko Electric Industries Co., Ltd.
    • Rie Mizutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board
    • Patent number 11,729,914
    • Issue date Aug 15, 2023
    • Shinko Electric Industries Co. Ltd.
    • Hiroshi Taneda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board
    • Patent number 11,716,810
    • Issue date Aug 1, 2023
    • Shinko Electric Industries Co., Ltd.
    • Masaya Takizawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board, laminated circuit board, and method of manufacturing...
    • Patent number 10,993,322
    • Issue date Apr 27, 2021
    • Shinko Electric Industries Co., Ltd.
    • Keigo Sato
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board, laminated wiring board, and semiconductor device
    • Patent number 10,905,005
    • Issue date Jan 26, 2021
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi Taneda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device with barrier layer
    • Patent number 10,593,621
    • Issue date Mar 17, 2020
    • Shinko Electric Industries Co., Ltd.
    • Keigo Sato
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD
    • Publication number 20240332772
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi TANEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAVEGUIDE SUBSTRATE AND METHOD OF MAKING WAVEGUIDE SUBSTRATE
    • Publication number 20240283121
    • Publication date Aug 22, 2024
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi TANEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND SEMICONDUCTOR DEVICE
    • Publication number 20230066839
    • Publication date Mar 2, 2023
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi TANEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT SUBSTRATE
    • Publication number 20230054390
    • Publication date Feb 23, 2023
    • Shinko Electric Industries Co., Ltd.
    • Rie MIZUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20220361340
    • Publication date Nov 10, 2022
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi TANEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20220361331
    • Publication date Nov 10, 2022
    • Shinko Electric Industries Co., Ltd.
    • Masaya TAKIZAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
    • Publication number 20220157697
    • Publication date May 19, 2022
    • Shinko Electric Industries Co., LTD.
    • Hiroshi TANEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD, LAMINATED CIRCUIT BOARD, AND METHOD OF MANUFACTURING...
    • Publication number 20200344879
    • Publication date Oct 29, 2020
    • Shinko Electric Industries Co., Ltd.
    • Keigo Sato
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD, LAMINATED WIRING BOARD, AND SEMICONDUCTOR DEVICE
    • Publication number 20200092993
    • Publication date Mar 19, 2020
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi TANEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH BARRIER LAYER
    • Publication number 20190131236
    • Publication date May 2, 2019
    • Shinko Electric Industries Co., Ltd.
    • Keigo SATO
    • H01 - BASIC ELECTRIC ELEMENTS