Hiroshi Tazawa

Person

Ichikawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip connection type semiconductor integrated circuit device
- Patent number 6,111,317
- Issue date Aug 29, 2000
- Kabushiki Kaisha Toshiba
- Takashi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for inspecting an LSI device in an assembling...
- Patent number 6,061,466
- Issue date May 9, 2000
- Kabushiki Kaisha Toshiba
- Chiaki Takubo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device using gold bumps and copper leads as bonding e...
- Patent number 6,049,130
- Issue date Apr 11, 2000
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier and assembly structure thereof
- Patent number 5,825,081
- Issue date Oct 20, 1998
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting type semiconductor device
- Patent number 5,801,447
- Issue date Sep 1, 1998
- Kabushiki Kaisha Toshiba
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bump electrode connected to an inner...
- Patent number 5,773,888
- Issue date Jun 30, 1998
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of fabricating the same and copper leads
- Patent number 5,747,881
- Issue date May 5, 1998
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising fine bump electrode having small si...
- Patent number 5,631,499
- Issue date May 20, 1997
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling bonding load of fine lead elec...
- Patent number 5,615,822
- Issue date Apr 1, 1997
- Kabushiki Kaisha Toshiba
- Chiaki Takubo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assembly having laminated semiconductor devices
- Patent number 5,508,563
- Issue date Apr 16, 1996
- Kabushiki Kaisha Toshiba
- Hiroshi Tazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly having laminated semiconductor devices
- Patent number 5,394,010
- Issue date Feb 28, 1995
- Kabushiki Kaisha Toshiba
- Hiroshi Tazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using film carrier
- Patent number 5,304,843
- Issue date Apr 19, 1994
- Kabushiki Kaisha Toshiba
- Chiaki Takubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC packing device
- Patent number 5,220,486
- Issue date Jun 15, 1993
- Kabushiki Kaisha Toshiba
- Chiaki Takubo
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Tazawa

Person

Patents Grantslast 30 patents

Flip-chip connection type semiconductor integrated circuit device

Apparatus and method for inspecting an LSI device in an assembling...

Semiconductor device using gold bumps and copper leads as bonding e...

Tape carrier and assembly structure thereof

Flip chip mounting type semiconductor device

Semiconductor device having a bump electrode connected to an inner...

Semiconductor device, method of fabricating the same and copper leads

Semiconductor device comprising fine bump electrode having small si...

Method and apparatus for controlling bonding load of fine lead elec...

Semiconductor assembly having laminated semiconductor devices

Semiconductor assembly having laminated semiconductor devices

Semiconductor device using film carrier

IC packing device