Hiroshi Terao

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with via hole of uneven width
- Patent number 7,750,478
- Issue date Jul 6, 2010
- Sanyo Electric Co., LTD
- Koujiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,732,925
- Issue date Jun 8, 2010
- Sanyo Electric Co., LTD
- Yoshio Okayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,416,963
- Issue date Aug 26, 2008
- Mitsuo Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,094,701
- Issue date Aug 22, 2006
- Sanyo Electric Co., LTD
- Mitsuo Umemoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070249158
- Publication date Oct 25, 2007
- SANYO ELECTRIC CO., LTD.
- Yoshio Okayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20060033168
- Publication date Feb 16, 2006
- SANYO ELECTRIC CO., LTD.
- Mitsuo Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20060024966
- Publication date Feb 2, 2006
- SANYO ELECTRIC CO., LTD.
- Mitsuo Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050189637
- Publication date Sep 1, 2005
- Sanyo Electric Co., Ltd.
- Yoshio Okayama
- H01 - BASIC ELECTRIC ELEMENTS