Hiroshi Tobimatsu

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,021,979
- Issue date Sep 20, 2011
- Renesas Electronics Corporation
- Takuya Futase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,851,355
- Issue date Dec 14, 2010
- Renesas Electronics Corporation
- Takuya Futase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having gettering layer, and method for manufactu...
- Patent number 7,582,950
- Issue date Sep 1, 2009
- Renesas Technology Corp.
- Kazuhito Matsukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of semiconductor device
- Patent number 7,489,040
- Issue date Feb 10, 2009
- Renesas Technology Corp.
- Koyu Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of semiconductor device
- Patent number 7,154,184
- Issue date Dec 26, 2006
- Renesas Technology Corp.
- Koyu Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having passivation fil...
- Patent number 6,759,317
- Issue date Jul 6, 2004
- Renesas Technology Corp.
- Hiroshi Tobimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,645,859
- Issue date Nov 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Mahito Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,544,904
- Issue date Apr 8, 2003
- Ryoden Semiconductor System Engineering Corporation
- Yuuki Kamiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive layer and manufacturing meth...
- Patent number 6,046,488
- Issue date Apr 4, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Takahiro Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a semiconductor substrate, an eleme...
- Patent number 5,600,151
- Issue date Feb 4, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Etsushi Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit devices
- Patent number 5,171,711
- Issue date Dec 15, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Tobimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale integration device
- Patent number 5,126,828
- Issue date Jun 30, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Muneo Hatta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110070731
- Publication date Mar 24, 2011
- Takuya Futase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING GETTERING LAYER, AND METHOD FOR MANUFACTU...
- Publication number 20090286354
- Publication date Nov 19, 2009
- Renesas Technology Corp.
- Kazuhito Matsukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20070269976
- Publication date Nov 22, 2007
- Takuya Futase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection structure of semiconductor device
- Publication number 20070096322
- Publication date May 3, 2007
- Renesas Technology Corp.
- Koyu Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having gettering layer, and method for manufactu...
- Publication number 20060022321
- Publication date Feb 2, 2006
- Renesas Technology Corp.
- Kazuhito Matsukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection structure of semiconductor device
- Publication number 20040251555
- Publication date Dec 16, 2004
- RENESAS TECHNOLOGY CORP.
- Koyu Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with insulator and manufacturing method therefor
- Publication number 20040016987
- Publication date Jan 29, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Mahito Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device having passivation fil...
- Publication number 20020090809
- Publication date Jul 11, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Tobimatsu
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Tobimatsu

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor chip having gettering layer, and method for manufactu...

Interconnection structure of semiconductor device

Interconnection structure of semiconductor device

Method of manufacturing semiconductor device having passivation fil...

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor device

Semiconductor device having conductive layer and manufacturing meth...

Semiconductor device comprising a semiconductor substrate, an eleme...

Method of manufacturing integrated circuit devices

Wafer scale integration device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP HAVING GETTERING LAYER, AND METHOD FOR MANUFACTU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Interconnection structure of semiconductor device

Semiconductor chip having gettering layer, and method for manufactu...

Interconnection structure of semiconductor device

Semiconductor device with insulator and manufacturing method therefor

Method of manufacturing semiconductor device having passivation fil...