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Hiroshi Tsuneno
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Sayama, JP
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last 30 patents
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Patent Grant
Glass-sealed ceramic package type semiconductor device
Patent number
4,554,573
Issue date
Nov 19, 1985
Hitachi, Ltd.
Hideharu Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of mounting a silicon pellet on a ceramic substrate
Patent number
4,437,228
Issue date
Mar 20, 1984
Hitachi, Ltd.
Hideharu Yamamoto
H01 - BASIC ELECTRIC ELEMENTS