Hiroshi Ushiki

Person

Iruma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conveying apparatus for plate-form members
- Patent number 6,793,066
- Issue date Sep 21, 2004
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method and apparatus for positioning a semiconductor pellet
- Patent number 6,632,703
- Issue date Oct 14, 2003
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 6,619,530
- Issue date Sep 16, 2003
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for positioning a semiconductor pellet
- Patent number 6,505,823
- Issue date Jan 14, 2003
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding apparatus
- Patent number 6,193,130
- Issue date Feb 27, 2001
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus
- Patent number 6,161,747
- Issue date Dec 19, 2000
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate transporting device
- Patent number 5,951,283
- Issue date Sep 14, 1999
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conveying devices used in a semiconductor assembly line
- Patent number 5,397,213
- Issue date Mar 14, 1995
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pushing mechanism in a lead frame conveying apparatus
- Patent number 5,220,997
- Issue date Jun 22, 1993
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Apparatus for feeding plate-form parts
- Patent number 5,217,107
- Issue date Jun 8, 1993
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame holding apparatus for use in wire bonders
- Patent number 5,181,646
- Issue date Jan 26, 1993
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Supply device used in a semiconductor assembly apparatus
- Patent number 5,097,983
- Issue date Mar 24, 1992
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for detecting height of bonding surface
- Patent number 5,046,655
- Issue date Sep 10, 1991
- Kabushiki Kaisha Shinkawa
- Yuji Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and apparatus
- Patent number 5,044,543
- Issue date Sep 3, 1991
- Kabushiki Kaisha Shinkawa
- Mikiya Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing semiconductor devices
- Patent number 4,986,460
- Issue date Jan 22, 1991
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece heating and feeding device
- Patent number 4,975,050
- Issue date Dec 4, 1990
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- F27 - FURNACES KILNS OVENS RETORTS

Patents Applicationslast 30 patents

Information Patent Application
Conveying apparatus for plate-form members
- Publication number 20040040823
- Publication date Mar 4, 2004
- KABUSHIKI KAISHA SHINKAWA
- Hiroshi Ushiki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD AND APPARATUS FOR POSITIONING A SEMICONDUCTOR PELLET
- Publication number 20020175202
- Publication date Nov 28, 2002
- HIROSHI USHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus
- Publication number 20020027152
- Publication date Mar 7, 2002
- KABUSHIKI KAISHA SHINKAWA
- Hiroshi Ushiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for positioning a semiconductor pellet
- Publication number 20010005640
- Publication date Jun 28, 2001
- KABUSHIKI KAISHA SHINKAWA
- Hiroshi Ushiki
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Ushiki

Person

Patents Grantslast 30 patents

Conveying apparatus for plate-form members

Method and apparatus for positioning a semiconductor pellet

Wire bonding apparatus

Apparatus for positioning a semiconductor pellet

Bump bonding apparatus

Bonding apparatus

Substrate transporting device

Conveying devices used in a semiconductor assembly line

Pushing mechanism in a lead frame conveying apparatus

Apparatus for feeding plate-form parts

Lead frame holding apparatus for use in wire bonders

Supply device used in a semiconductor assembly apparatus

Device for detecting height of bonding surface

Wire bonding method and apparatus

Apparatus for manufacturing semiconductor devices

Workpiece heating and feeding device

Patents Applicationslast 30 patents

Conveying apparatus for plate-form members

METHOD AND APPARATUS FOR POSITIONING A SEMICONDUCTOR PELLET

Wire bonding apparatus

Apparatus for positioning a semiconductor pellet