Hiroshige Ogawa

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Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring design support apparatus for bond wire of semiconductor devices
- Patent number 7,725,847
- Issue date May 25, 2010
- Mitsubishi Denki Kabushiki Kaisha
- Akihiro Goto
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Design Support Apparatus for Semiconductor Devices
- Publication number 20080250363
- Publication date Oct 9, 2008
- Mitsubishi Denki Kabushiki Kaisha
- Akihiro Goto
- G06 - COMPUTING CALCULATING COUNTING