Hiroshige Ohkawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board incorporating semiconductor IC and manufacturing meth...
- Patent number 9,635,756
- Issue date Apr 25, 2017
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring board
- Patent number 8,303,752
- Issue date Nov 6, 2012
- TDK Corporation
- Kenichi Kawabata
- B32 - LAYERED PRODUCTS
Information Patent Grant
COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREP...
- Patent number 6,908,960
- Issue date Jun 21, 2005
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramics composition
- Patent number 6,407,020
- Issue date Jun 18, 2002
- TDK Corporation
- Hiroshige Ohkawa
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...
- Publication number 20220238474
- Publication date Jul 28, 2022
- TDK Corporation
- Toshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD INCORPORATING SEMICONDUCTOR IC AND MANUFACTURING METH...
- Publication number 20140085854
- Publication date Mar 27, 2014
- TDK Corporation
- Kazutoshi TSUYUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing wiring board
- Publication number 20100051189
- Publication date Mar 4, 2010
- TDK Corporation
- Kenichi Kawabata
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic component-embedded board and method of manufacturing the...
- Publication number 20090025961
- Publication date Jan 29, 2009
- TDK Corporation
- Yoshikazu Kanemaru
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Composite dielectric material, composite dielectric substrate, prep...
- Publication number 20050154110
- Publication date Jul 14, 2005
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite dielectric material, composite dielectric substrate, prep...
- Publication number 20050130446
- Publication date Jun 16, 2005
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite dielectric material, composite dielectric substrate, prep...
- Publication number 20050130447
- Publication date Jun 16, 2005
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite dielectric material, composite dielectric substrate, prep...
- Publication number 20020132898
- Publication date Sep 19, 2002
- TDK Corporation
- Minoru Takaya
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshige Ohkawa

Person

Patents Grantslast 30 patents

Circuit board incorporating semiconductor IC and manufacturing meth...

Method of manufacturing wiring board

COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREP...

Ceramics composition

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...

CIRCUIT BOARD INCORPORATING SEMICONDUCTOR IC AND MANUFACTURING METH...

Method of manufacturing wiring board

Electronic component-embedded board and method of manufacturing the...

Composite dielectric material, composite dielectric substrate, prep...

Composite dielectric material, composite dielectric substrate, prep...

Composite dielectric material, composite dielectric substrate, prep...

Composite dielectric material, composite dielectric substrate, prep...