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Hirotada Honma

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  • Tokyo, JP
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Patents Applicationslast 30 patents

  • Information Patent Application

    WIRE BONDING USING A FLOATING PAD
    • Publication number 20250201681
    • Publication date Jun 19, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Hiroshi INOGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IGNITER CIRCUIT HAVING AN ADJUSTABLE OVER DWELL TIME
    • Publication number 20240429727
    • Publication date Dec 26, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Hirotada HONMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Radio-frequency circuit
    • Publication number 20100201447
    • Publication date Aug 12, 2010
    • SEMICONDUCTOR TECHNOLOGY ACADAMIC RESEARCH CENTER
    • Akira Hyogo
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Radio-frequency circuit
    • Publication number 20060194559
    • Publication date Aug 31, 2006
    • Semiconductor Technology Academic Research Center
    • Akira Hyogo
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE