Hirotaka Kato

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Hiratsuka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating direct-bonded semiconductor wafers
- Patent number 5,932,048
- Issue date Aug 3, 1999
- Komatsu Electronic Metals Co., Ltd.
- Hiroshi Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for peeling a bonded wafer
- Patent number 5,897,743
- Issue date Apr 27, 1999
- Komatsu Electronic Metals Co., Ltd.
- Kazuaki Fujimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of processing a surface of a semiconductor substrate
- Patent number 5,849,603
- Issue date Dec 15, 1998
- Komatsu Electronic Metals Co., Ltd.
- Hirotaka Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator substrate and a method for fabricating the same
- Patent number 5,770,511
- Issue date Jun 23, 1998
- Komatsu Electronic Metals Co., Ltd.
- Kei Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of evaluating a density of oxygen-precipitation defects in a...
- Patent number 5,742,175
- Issue date Apr 21, 1998
- Komatsu Electronic Metals, Inc.
- Hirotaka Kato
- G01 - MEASURING TESTING
Information Patent Grant
Method of measuring a Fe-B concentration of a silicon wafer
- Patent number 5,742,176
- Issue date Apr 21, 1998
- Komatsu Electronic Metals Co., Ltd.
- Hirotaka Kato
- G01 - MEASURING TESTING