Hirotaka Kobayashi

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Kodaira, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for multilayer wiring connections and bonding pad adhesion...
- Patent number 6,573,170
- Issue date Jun 3, 2003
- Hitachi, Ltd.
- Takashi Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor integrated circuit device and process for manufacturi...
- Publication number 20010019180
- Publication date Sep 6, 2001
- Takashi Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and process for manufacturi...
- Publication number 20010005624
- Publication date Jun 28, 2001
- Takashi Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS